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A method for improving surface pool boiling heat transfer performance based on femtosecond laser splicing processing technology

A technology of boiling heat transfer and processing technology, applied in laser welding equipment, heat transfer modification, metal processing equipment, etc., can solve the problem of low CHF on hydrophobic surfaces, improvement of heat transfer performance of non-heat transfer surfaces, and reduction of surface heat transfer coefficients, etc. question

Active Publication Date: 2021-10-12
CHANGCHUN UNIV OF SCI & TECH
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Problems solved by technology

[0004] However, the current surface improvement technology cannot make the heat transfer performance of the heat transfer surface greatly improved simultaneously. For example, the hydrophilic surface can greatly increase the CHF (critical heat flux), but at the same time, the hydrophilicity of the surface reduces the heat transfer coefficient of the surface.
The hydrophobic surface can greatly improve the HTC (heat transfer coefficient), but the hydrophobicity of the surface makes the surface easier to enter film boiling, which makes the CHF of the hydrophobic surface lower
In practical applications, both CHF and HTC are key characteristic quantities for evaluating surface heat transfer performance, and unilateral performance improvement largely limits the practical application of improved surfaces

Method used

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  • A method for improving surface pool boiling heat transfer performance based on femtosecond laser splicing processing technology
  • A method for improving surface pool boiling heat transfer performance based on femtosecond laser splicing processing technology
  • A method for improving surface pool boiling heat transfer performance based on femtosecond laser splicing processing technology

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specific Embodiment approach

[0024] detailed description:. First of all, choose German Warrior brand sandpaper 400, 600, 800, 1200, 1500, 2000 mesh sandpaper to polish the rough metal surface in a water bath, then use a grinder to polish, and finally use alcohol and deionized water to perform ultrasonic cleaning, and finally obtain the metal surface. Surface roughness (ratio of real area to projected area) is approximately 1, with an average roughness of 0.1 μm.

[0025] The surface is scanned and processed by femtosecond laser raster scanning processing method: the femtosecond laser pulse with a repetition rate of 1kHZ (center wavelength 800nm, femtosecond laser system of Coherent Corporation of the United States) passes through the He-Ne laser collimation system, and then the beam is incident Through the 20cm focusing lens, the femtosecond laser beam focused by the lens is directly on the metal sample on the two-dimensional electric translation stage (the experiment uses a German PI translation stage, X...

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Abstract

The invention relates to a method for improving surface pool boiling heat transfer performance based on femtosecond laser splicing processing technology, and belongs to the technical field of enhanced heat transfer. The rapid economic development has made stable heat dissipation under high heat flow an urgent problem to be solved. As an efficient and stable heat transfer method, boiling heat transfer has been studied more and more. The micro-nano improvement of the heat transfer surface has become an applied technology to enhance heat transfer. However, the problem that the heat transfer performance cannot be improved synchronously (CHF and HTC) has not been resolved. The femtosecond laser splicing processing technology proposed in the present invention improves the surface pool boiling heat transfer performance, which can simultaneously improve the surface heat transfer performance.

Description

technical field [0001] The invention relates to the technical field of enhanced heat transfer, in particular to a method for improving surface heat transfer performance by preparing spliced ​​surfaces through femtosecond laser splicing technology. Background technique [0002] With the development of society and the gradual improvement of the level of industrialization. As large as engineering equipment and as small as electronic devices, they are all developing in the direction of high integration and micro-scale, which means that the energy load per unit size of the material itself is getting higher and higher, and the stability and high efficiency of the high heat flow state Heat dissipation has become an urgent problem to be solved. The traditional heat dissipation method of strengthening convection can no longer meet such a huge heat dissipation demand. In contrast, boiling heat transfer utilizes a large amount of latent heat of vaporization or liquefaction in the pha...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28F13/18B23K26/21B23K26/60B23K26/082
CPCB23K26/082B23K26/21B23K26/60
Inventor 陶海岩金瑞伯刘思琦
Owner CHANGCHUN UNIV OF SCI & TECH
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