Method for improving surface pool boiling heat transfer performance based on femtosecond laser joint processing technology

A processing technology, femtosecond laser technology, is applied in the field of enhanced heat transfer, which can solve the problems of performance improvement, limit the practical application of improved surfaces, improve the heat transfer performance of non-heat transfer surfaces, and reduce the surface heat transfer coefficient, so as to achieve low overall cost, Excellent boiling heat transfer performance, simple process effect
CN110842360AActive Publication Date: 2020-02-28CHANGCHUN UNIV OF SCI & TECH

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CHANGCHUN UNIV OF SCI & TECH
Publication Date
2020-02-28

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Abstract

The invention relates to a method for improving the surface pool boiling heat transfer performance based on a femtosecond laser joint processing technology and belongs to the technical field of heat transfer enhancement. With top-speed development of economy, stable heat dissipation under high heat flow becomes an urgently-achieved aim, and more and more researches have been made on boiling heat transfer as an efficient and stable heat transfer mode. Micro-nano improvement on the heat transfer surface has become an application technology for heat transfer enhancement. But the problem that theheat transfer performance (CHF and HTC) cannot be synchronously improved hasn't been solved yet. The method for improving the surface pool boiling heat transfer performance based on the femtosecond laser joint processing technology can synchronously improve the surface heat transfer performance.
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Description

technical field

[0001] The invention relates to the technical field of enhanced heat transfer, in particular to a method for improving surface heat transfer performance by preparing spliced ​​surfaces through femtosecond laser splicing technology. Background technique

[0002] With the development of society and the gradual improvement of the level of industrialization. As large as engineering equipment and as small as electronic devices, they are all developing in the direction of high integration and micro-scale, which means that the energy load per unit size of the material itself is getting higher and higher, and the stability and high efficiency of the high heat flow state Heat dissipation has become an urgent problem to be solved. The traditional heat dissipation method of strengthening convection can no longer meet such a huge heat dissipation demand. In contrast, boiling heat transfer utilizes a large amount of latent heat of vaporization or liquefaction in the pha...

Claims

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