Method for improving surface pool boiling heat transfer performance based on femtosecond laser joint processing technology

A processing technology, femtosecond laser technology, is applied in the field of enhanced heat transfer, which can solve the problems of performance improvement, limit the practical application of improved surfaces, improve the heat transfer performance of non-heat transfer surfaces, and reduce the surface heat transfer coefficient, so as to achieve low overall cost, Excellent boiling heat transfer performance, simple process effect

Active Publication Date: 2020-02-28
CHANGCHUN UNIV OF SCI & TECH
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Problems solved by technology

[0004] However, the current surface improvement technology cannot make the heat transfer performance of the heat transfer surface greatly improved simultaneously. For example, the hydrophilic surface can greatly increase the CHF (critical heat flux), but at the same time, the hydrophilicity of the surface reduces the heat transfer coefficient of the surface.
The hydrophobic surface can greatly improve the HTC (heat transfer coefficient), but the hydrophobicity of the surface makes the surface easier to enter film boiling, which makes the CHF of the hydrophobic surface lower
In practical applications, both CHF and HTC are key characteristic quantities for evaluating surface heat transfer performance, and unilateral performance improvement largely limits the practical application of improved surfaces

Method used

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  • Method for improving surface pool boiling heat transfer performance based on femtosecond laser joint processing technology
  • Method for improving surface pool boiling heat transfer performance based on femtosecond laser joint processing technology
  • Method for improving surface pool boiling heat transfer performance based on femtosecond laser joint processing technology

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specific Embodiment approach

[0024] detailed description:. First of all, choose German Warrior brand sandpaper 400, 600, 800, 1200, 1500, 2000 mesh sandpaper to polish the rough metal surface in a water bath, then use a grinder to polish, and finally use alcohol and deionized water to perform ultrasonic cleaning, and finally obtain the metal surface. Surface roughness (ratio of real area to projected area) is approximately 1, with an average roughness of 0.1 μm.

[0025] The surface is scanned and processed by femtosecond laser raster scanning processing method: the femtosecond laser pulse with a repetition rate of 1kHZ (center wavelength 800nm, femtosecond laser system of Coherent Corporation of the United States) passes through the He-Ne laser collimation system, and then the beam is incident Through the 20cm focusing lens, the femtosecond laser beam focused by the lens is directly on the metal sample on the two-dimensional electric translation stage (the experiment uses a German PI translation stage, X...

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Abstract

The invention relates to a method for improving the surface pool boiling heat transfer performance based on a femtosecond laser joint processing technology and belongs to the technical field of heat transfer enhancement. With top-speed development of economy, stable heat dissipation under high heat flow becomes an urgently-achieved aim, and more and more researches have been made on boiling heat transfer as an efficient and stable heat transfer mode. Micro-nano improvement on the heat transfer surface has become an application technology for heat transfer enhancement. But the problem that theheat transfer performance (CHF and HTC) cannot be synchronously improved hasn't been solved yet. The method for improving the surface pool boiling heat transfer performance based on the femtosecond laser joint processing technology can synchronously improve the surface heat transfer performance.

Description

technical field [0001] The invention relates to the technical field of enhanced heat transfer, in particular to a method for improving surface heat transfer performance by preparing spliced ​​surfaces through femtosecond laser splicing technology. Background technique [0002] With the development of society and the gradual improvement of the level of industrialization. As large as engineering equipment and as small as electronic devices, they are all developing in the direction of high integration and micro-scale, which means that the energy load per unit size of the material itself is getting higher and higher, and the stability and high efficiency of the high heat flow state Heat dissipation has become an urgent problem to be solved. The traditional heat dissipation method of strengthening convection can no longer meet such a huge heat dissipation demand. In contrast, boiling heat transfer utilizes a large amount of latent heat of vaporization or liquefaction in the pha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/21B23K26/60B23K26/082
CPCB23K26/082B23K26/21B23K26/60
Inventor 陶海岩金瑞伯刘思琦
Owner CHANGCHUN UNIV OF SCI & TECH
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