Thin-wall high-rib wallboard component space envelope forming envelope die correction method

A wall plate and high-rib technology, which is applied in the field of enveloping mold correction of thin-walled and high-rib wall plate components, to achieve the effects of improving mechanical properties, reducing surface defects and prolonging service life.

Active Publication Date: 2020-03-24
WUHAN UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there is no report on the modification method of the envelope mold for the space envelope forming of thin-walled and high-rib panel members

Method used

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  • Thin-wall high-rib wallboard component space envelope forming envelope die correction method
  • Thin-wall high-rib wallboard component space envelope forming envelope die correction method
  • Thin-wall high-rib wallboard component space envelope forming envelope die correction method

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Embodiment Construction

[0028] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation manners of the present invention will now be described in detail with reference to the accompanying drawings.

[0029] Such as figure 1 As shown, the thin-walled high-strength panel component space envelope forming envelope mold correction method of the present invention comprises the following steps:

[0030] S1. Determine the correction principle of the envelope die for the space envelope forming of thin-walled and high-rib panel components. Calculate the maximum interference amount of each point in the interference area in the same specific rectangular coordinate system, and then determine the correction amount and correction equation of each point, and correct the envelope mode interference area through the correction equation. If the interference area cannot be completely eliminated, increase Correct the correction amount o...

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Abstract

The invention relates to a thin-wall high-rib wallboard component space envelope forming envelope die correction method, which comprises the following steps: S1, a rectangular coordinate system is established; S2, a coordinate w(x, y, z) of any point in the envelope mode interference area and a corresponding interference plane equation Ax + By + Cz + D = 0 are determined, and the maximum interference amount of the point is calculated; S3, a correction amount k and a point wc coordinate (xc, yc, zc) after the point w is corrected are determined according to the interference plane equation and the maximum interference amount in the step S2 so as to correct the interference area; S4, whether the corrected envelope die and the wallboard component interfere with each other or not is judged, andif so, the area in which interference still exists is corrected again by increasing the correction amount; and S5, the step S4 is repeated until a non-interference envelope die is obtained. Accordingto the envelope die correction method, the interference area on the envelope die and the interference area of the wallboard component can be eliminated, and the non-interference envelope die is obtained.

Description

technical field [0001] The invention relates to the field of space enveloping forming, and more specifically relates to a method for correcting an envelope mold for space enveloping forming of a thin-walled high-rib panel member. Background technique [0002] Thin-walled high-strength panel members are light in weight and high in load-carrying capacity, and are important components of storage tanks, aircraft cabins, and ship hulls. However, thin-walled and high-rib panel components have complex geometric shapes, high rib height-thickness ratios, and difficult manufacturing. The high-performance and high-precision manufacturing methods have always been research hotspots at home and abroad. [0003] The space enveloping forming method is a new method of continuous local plastic forming. The blank is subjected to multi-pass local rolling forming through the envelope motion of the enveloping die to realize high-performance and low-cost manufacturing of thin-walled and high-stren...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21D3/16
CPCB21D3/16
Inventor 华林韩星会胡亚雄庄武豪
Owner WUHAN UNIV OF TECH
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