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Chip anti-transfer method

An anti-transfer and chip technology, which is applied in the direction of recording carriers used in machines, instruments, computer components, etc., can solve the problems of RFID tag chip transfer and reuse

Active Publication Date: 2020-03-27
华大恒芯科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a chip transfer prevention method, which solves the problem of the RFID tag chip being transferred and reused without increasing the logic of the chip transfer prevention function

Method used

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Examples

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Embodiment Construction

[0032] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described below are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0033] figure 1 It is a schematic flow chart of a chip transfer prevention method provided by an embodiment of the present invention, such as figure 1 As shown, the method includes the following steps:

[0034] Step S101 : providing anti-transfer bumps coated with an anti-corrosion protective layer near the electrical connection bumps on the chip.

[0035] Step S102: connecting the anti-transfer bumps coated with an anti-corrosion protective layer with the electrical connection bumps.

[0036] Step S103: After the chip and the tag antenna are packaged together, the electrical connection bump is connected to the tag antenna, and the anti-transfer bump co...

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PUM

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Abstract

The invention discloses a chip anti-transfer method, which relates to the technical field of electronic anti-counterfeiting, and comprises the following steps of: arranging anti-transfer salient points of which the surfaces are coated with easily-corrosive protective layers near electric connection salient points on a chip; connecting the anti-transfer bumps of which the surfaces are coated with the easy-to-corrode protective layers with the electric connection bumps; and after the chip and the tag antenna are packaged together, enabling the electric connection convex points to be conducted with the tag antenna, and enabling the anti-transfer convex points of which the surfaces are coated with the easy-to-corrode protective layers not to be conducted with the tag antenna. According to themethod, the anti-transfer bumps of which the surfaces are coated with the easy-to-corrode protective layers, on the chip are used, so that physical damage to the chip during chip transfer is realized,and the chip is effectively prevented from being successfully transferred.

Description

technical field [0001] The invention relates to the technical field of electronic anti-counterfeiting, in particular to a method for preventing chip transfer. Background technique [0002] In passive RFID anti-counterfeiting applications, preventing RFID tags from being transferred and reused is an important indicator to consider the system's anti-counterfeiting capabilities. Commonly used anti-transfer solutions mostly consider the anti-transfer of antennas, such as fragile materials such as fragile paper and ceramic sheets as antenna substrates. When attempting to transfer the tag the antenna is damaged rendering the tag useless. But the disadvantage of this method is that the chip is intact, counterfeiters can use special reagents to remove the chip from the label intact, and then package it on a new antenna, so as to realize the reuse of the chip. This solution only destroys the antenna and cannot completely realize the anti-transfer of the label. [0003] Another chi...

Claims

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Application Information

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IPC IPC(8): G06K19/077
CPCG06K19/0772
Inventor 马纪丰闫运来宋忠昌
Owner 华大恒芯科技有限公司