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Chip anti-transfer method, anti-transfer chip and radio frequency tag

An anti-transfer and chip technology, which is applied to record carriers, instruments, and electrical components used by machines, can solve the problems of increasing the complexity and cost of chip design, increasing the process of testing bumps, etc., and achieving reduction in production costs and processing The effect of simple process

Inactive Publication Date: 2021-01-01
华大恒芯科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This solution needs to design special functional logic for the anti-transfer function, which increases the complexity and design cost of the chip design; in addition, there is an anti-transfer solution that processes test bumps on the chip. When connected to the antenna, the tag can fail, but this also increases the process of adding test bumps

Method used

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  • Chip anti-transfer method, anti-transfer chip and radio frequency tag
  • Chip anti-transfer method, anti-transfer chip and radio frequency tag
  • Chip anti-transfer method, anti-transfer chip and radio frequency tag

Examples

Experimental program
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Effect test

Embodiment 1

[0032] refer to Figure 1a , is a schematic flowchart of a method for preventing chip transfer provided by an embodiment of the present invention. Specifically, a method for preventing chip transfer includes the following steps:

[0033] S100: Process and form the bumps of the chip; then perform step S200;

[0034] In this embodiment, the traditional chip processing is changed, and a composite material is used as the manufacturing component of the chip electrical connection bump. Specifically, the components of the composite material used include: epoxy resin and gold nickel particles; Nickel particles are filled in the epoxy resin;

[0035] In this embodiment, there may be only one electrical connection bump formed by processing composite materials, and the remaining electrical connection bumps may be made of gold or copper materials; ;

[0036] In this embodiment, the electrical connection bump formed by processing the composite material can conduct electricity and is easi...

Embodiment 2

[0047] The invention also provides an anti-transfer chip, Figure 2a and Figure 2b is to use Figure 1b A side view and a top view of an embodiment of an anti-transfer chip made in the process flow, the plane of the chip body 3 is rectangular, and its four corners are respectively provided with electrical connection bumps 1 and 2, and supporting bumps 5 and 6. In an embodiment, both the electrical connection bumps 1 and 2 are processed from a composite material, and the components of the composite material include: epoxy resin and gold-nickel particles; the gold-nickel particles are filled in the epoxy resin, and the composite material is processed to form The electrical connection bumps can conduct electricity and are easily soluble in the special cleaning solution for the conductive adhesive; of course, the above is only a specific method in this implementation. In other embodiments, only the electrical connection bumps 1 can be processed into composite materials. Yes, th...

Embodiment 3

[0050] Based on the anti-transfer chip of embodiment 2, a radio frequency tag is provided in this embodiment, for details refer to Figure 3a and Figure 3b , specifically, the radio frequency tag includes: the anti-transfer chip in embodiment 2; a tag antenna packaged with the anti-transfer chip through conductive glue.

[0051] The tag antenna includes an antenna substrate 7 (the material is generally PET, coated paper, fragile paper, etc.) and a group of antenna coils 8 fixedly arranged on the antenna substrate 7 .

[0052] The chip body 3 with electrical connection bumps 1 and 2 and support bumps 5 and 6 is packaged upside down on the tag antenna, and the electrical connection bumps 1 and 2 are connected to the antenna coil 8 through anisotropic conductive glue 9 and conduction; The electrical connection bumps 1 and 2 are both processed from composite materials, and the components of the composite material include: epoxy resin and gold-nickel particles; gold-nickel partic...

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PUM

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Abstract

The invention provides a chip anti-transfer method, an anti-transfer chip and a radio frequency label, and the method comprises the following steps: processing to form salient points of the chip, thesalient points comprising an electric connection salient point and a support salient point; wherein at least one electric connection convex point is formed by processing a composite material; packaging the processed chip and the tag antenna together, and conducting the electrical connection bumps with the tag antenna; separating the chip and the tag antenna which are packaged together during chiptransfer; soaking the separated chip into a special cleaning solution for the conductive adhesive so as to clean the conductive adhesive attached to the chip; when the special cleaning solution for the conductive adhesive is used for cleaning the conductive adhesive attached to the chip, dissolving the electric connection salient points formed by processing the composite material on the chip by the special cleaning solution for the conductive adhesive. A composite material is used as a material of the electric connection bumps, the material is conductive and is easily dissolved in a conductiveadhesive, cleaning fluid is used for transferring the chip, and the electric connection bumps made of the composite material are also corroded when the chip is transferred, so that chip transfer prevention is realized.

Description

technical field [0001] The invention relates to the technical field of electronic anti-counterfeiting, in particular to a chip transfer prevention method, a transfer prevention chip and a radio frequency label. Background technique [0002] In passive RFID anti-counterfeiting applications, preventing RFID tags from being transferred and reused is an important indicator to consider the system's anti-counterfeiting capabilities. Commonly used anti-transfer solutions mostly consider the anti-transfer of the antenna. For example, the base material of the antenna is made of fragile materials such as fragile paper and ceramic sheets; when trying to transfer the label, the antenna is damaged and the label becomes invalid. But the disadvantage of this method is that the chip is intact. Counterfeiters can remove the chip from the label with a special reagent, and then package it on a new antenna, so as to realize the reuse of the chip. This solution only destroys the antenna and cann...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077H01L23/488H01L23/00
CPCG06K19/0776G06K19/07773H01L23/488H01L24/13H01L2224/1329H01L2224/13344H01L2224/13355H01L2224/16225H01L2224/32225H01L2224/73204H01L2924/00
Inventor 闫运来马纪丰
Owner 华大恒芯科技有限公司