Chip-on-film and display device

A chip-on-chip film and chip technology, which is applied in the field of chip-on-chip films and display devices, can solve problems such as abnormal function of the display panel, misplaced connection between output pins and binding pads, etc., to improve production yield and reliability, and prevent functional abnormal effect

Active Publication Date: 2020-03-27
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the bonding process of the chip-on-chip film and the display panel, it has always been a difficult problem in this field to ensure the accurate alignment of the output pins and the bonding pads. It is inevitable that the display panel will be thermally expanded to cause changes in the spacing of the output pins. If there is a deviation during the alignment process, it is easy to have a misaligned connection between the output pins and the binding pad, which will lead to abnormal function of the display panel.

Method used

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  • Chip-on-film and display device

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Embodiment Construction

[0025] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [top], [bottom], [front], [back], [left], [right], [inside], [outside], [side], etc., are only for reference The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention. In the figures, structurally similar elements are denoted by the same reference numerals.

[0026] An embodiment of the present invention provides a chip-on-film, by setting horizontal pins disconnected from the longitudinal pins on the side of the longitudinal pins of the chip-on-film, and implementing the chip-on-film through the horizontal pins Accurate alignment with the display panel solves the problem of difficult alignment in the bonding process of the...

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Abstract

The invention provides a chip-on-film and a display device, the chip-on-film comprises a substrate, a longitudinal pin used for binding connection and a transverse pin used for alignment, the longitudinal pin and the transverse pin are arranged on the substrate, and the longitudinal pin and the transverse pin are disconnected and insulated; the display device comprises the chip-on-film and a display panel, a binding pad and an alignment pad are arranged on the display panel, an alignment notch is formed in the alignment pad, the transverse pin is arranged in the alignment notch, and the binding pad is connected with the longitudinal pin in an alignment binding mode. According to the chip-on-film and the display device, accurate alignment connection of the chip-on-film and the display device can be achieved, and the production yield and reliability are improved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a chip-on-chip film and a display device. Background technique [0002] With the development of display technology, especially the popularity of handheld display devices such as mobile phones and tablet computers, users have higher and higher requirements for product resolution. High resolution means higher wiring density under the same size. The higher the accuracy requirements of the bonding process. [0003] In the prior art, the control of the display function of the display panel by the driver chip is realized by binding and connecting a Chip on Film (COF) carrying the driver chip to an input terminal of the display panel. Therefore, output pins are provided on the COF, and binding pads correspondingly connected to the output pins are provided on the display panel. In the bonding process of the chip-on-chip film and the display panel, it has always been a difficult proble...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F9/00
CPCG09F9/00
Inventor 李继龙王月
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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