Pre-alignment device and method

Abstract

The invention discloses a pre-alignment device and method. The device includes a bottom plate, a lifting shaft arranged on the bottom plate, a compensation shaft and an optical-mechanical assembly, and also includes a rotating shaft assembly, a claw disk and a ring suction cup. The rotating shaft assembly includes a set The rotating shaft on the lifting shaft and the extension rod connected with the rotating shaft; the claw plate is connected with the extension rod, and a plurality of first adsorption components are arranged at intervals; the ring suction cup is connected with the compensation shaft, and a plurality of second adsorption components are arranged on it Assemblies, the diameter of the ring suction cup is smaller than the distribution circle diameter of the claw disk, and the ring suction cup is set outside the rotating shaft assembly, there is a gap between the ring suction cup and the rotating shaft assembly, and the claw disk and the ring suction cup are provided on the claw disk A handover gap for the second adsorption component to pass through when silicon wafers are handed over. The above-mentioned pre-alignment device realizes the adsorption positioning and flattening treatment of the large warped sheet, and improves the pre-alignment accuracy of the large warped sheet. Correspondingly, the present invention also provides a pre-alignment method.

Description

Pre-alignment device and method technical field [0001] The present invention relates to the field of integrated circuit manufacturing, and in particular, to a pre-alignment device and method. Background technique In the production process of semiconductor devices, in order to ensure that the silicon wafer can be exposed in a fixed attitude, the silicon wafer During the transfer process, it needs to be transferred to the workpiece table with high centering and orientation accuracy. Since the silicon wafer is placed in the silicon wafer slot, Its position and orientation are uncertain, so the wafers are required to be pre-aligned with a certain degree of accuracy before being transferred to the workpiece table. The current position of the silicon wafer is determined by measuring the center of the silicon wafer, and the orientation of the silicon wafer is determined by measuring the direction of the gap of the silicon wafer. direction. [0003] With the development of ...

AI Technical Summary

Problems solved by technology

However, if the diameter of the distribution circle of the half-moon sucker increases, the diameter of the distribution circle of the half-moon sucker will be larger than the diameter of the warped sheet, and the half-moon sucker will be located outside the distribution area of ​​the warped sheet and cannot absorb the warped sheet

Therefore, the existing silicon wafer pre-alignment device cannot meet the pre-alignment positioning requirements of large warped wafers

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