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Pre-alignment device and method of warping sheet

A pre-alignment and warping film technology, which is applied in the field of pre-alignment devices for warping films, can solve the problems of inability to absorb warping films and meet the pre-alignment and positioning requirements of large warping films, etc.

Active Publication Date: 2020-07-07
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the diameter of the distribution circle of the half-moon sucker increases, the diameter of the distribution circle of the half-moon sucker will be larger than the diameter of the warped sheet, and the half-moon sucker will be located outside the distribution area of ​​the warped sheet and cannot absorb the warped sheet
Therefore, the existing silicon wafer pre-alignment device cannot meet the pre-alignment positioning requirements of large warped wafers

Method used

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  • Pre-alignment device and method of warping sheet
  • Pre-alignment device and method of warping sheet
  • Pre-alignment device and method of warping sheet

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Embodiment Construction

[0045] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0046]In describing the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", The orientation or positional relationship indicated by "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the referred device Or elements must have a certain orientation, be constructed and operate in a certain orientation, and thus should not be construed as limiting the invention.

[0047] see Figure 1 to Figure 3 , The pre-alignment device for the warped sheet in one embodiment includes an air nozzle assembly 70 and a roller assembly 80 ....

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Abstract

The invention discloses a pre-alignment device and method of a warping sheet. The device comprises an air nozzle assembly and a roller assembly, wherein the air nozzle assembly is used for blowing airto the edge surface of the warping sheet and applying pressure to the edge surface of the warping sheet so as to enable the edge region of the warping sheet to be flattened; and the roller assembly and the air nozzle assembly are correspondingly arranged in the vertical direction, and the roller assembly is used for supporting the edge of the warping sheet on the other side of the warping sheet when the air nozzle assembly blows air to the warping sheet. According to the pre-alignment device of the warping sheet, adsorption positioning and leveling treatment on the large warping sheet are achieved, and the pre-alignment precision of the large warping sheet is improved. Correspondingly, the invention further provides a pre-alignment method of the warping sheet.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a pre-alignment device and method for warped sheets. Background technique [0002] In the production process of semiconductor devices, in order to ensure that the silicon wafer can be exposed in a fixed posture, the silicon wafer needs to be transferred to the workpiece table with high centering and orientation accuracy during the transmission process. Since the position and direction of the silicon wafer are uncertain when it is placed in the silicon wafer tank, it is required to pre-align the silicon wafer with a certain precision before the silicon wafer is transferred to the workpiece table, which is determined by measuring the center of the silicon wafer The current position of the silicon wafer, the direction of the silicon wafer is determined by measuring the direction of the notch of the silicon wafer. [0003] With the development of the semiconductor ind...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/68
CPCH01L21/68
Inventor 王刚付红艳黄栋梁陈文枢夏海
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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