Pre-alignment device and silicon wafer pre-alignment method

Abstract

The invention provides a pre-alignment device. The device is characterized in that a handover bearing unit is arranged in a hollow area of a hollow bearing disc, a vertical movement unit and a horizontal position compensation unit which drive the handover bearing unit to move are arranged in a rotary movement unit, so the handover bearing unit can shuttle up and down and move horizontally in the hollow area, so the area of the bearing area of the hollow bearing disc is increased, and the size of equipment can be prevented from being increased; suckers, absorption holes and protruding structures used for supporting silicon wafers are arranged on the hollow bearing disc, so the silicon wafers borne by the hollow bearing disc can be absorbed flatly, a problem that the ultrathin silicon wafersare fragile during pre-alignment can be solved, and pre-alignment precision of the ultrathin silicon wafers is improved. The invention further provides a silicon wafer pre-alignment method, and the silicon wafer pre-alignment device is adopted to realize pre-alignment of the silicon wafers. The invention further provides exposure equipment, a photoetching system, a silicon wafer processing systemand a silicon wafer processing method, which are realized by adopting the pre-alignment device and the pre-alignment method provided by the invention.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a pre-alignment device and a silicon chip pre-alignment method. Background technique [0002] In the semiconductor industry, there are more and more types of silicon wafers that need to be processed, such as standard wafers, warped wafers, ultra-thin wafers, etc. Among them, there are many studies on the treatment methods of standard wafers and warped wafers, but the ultra-thin wafers are easily broken due to the influence of the strength of the silicon wafer itself during adsorption and transportation. In addition, due to the thinning of the silicon wafer thickness, the If the stiffness is weakened, the edge of the silicon wafer will collapse, which will cause defocusing of the silicon wafer during pre-alignment and edge exposure on a machine such as a lithography machine, which will eventually affect the accuracy of silicon wafer pre-alignment and edge expos...

AI Technical Summary

Problems solved by technology

As the thickness of the silicon wafer becomes thinner, the existing pre-alignment device reduces the edge collapse of the silicon wafer by increasing the bearing surface of the rotating carrier plate, but this will increase the occupied area of ​​the silicon wafer handover robot at the same time, making the size of the equipment smaller. large, not conducive to placement

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