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Cooling cabinet with combination of liquid cooling and air cooling heat dissipation, and cooling system with combination of liquid cooling and air cooling heat dissipation

A cooling system and cooling cabinet technology, applied in cooling/ventilation/heating renovation, electrical components, electrical equipment structural components, etc., can solve problems such as poor compatibility and large impact on the layout of the equipment room, and achieve the effect of wide applicability

Active Publication Date: 2020-04-03
SHANDONG CHAOYUE DATA CONTROL ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The immersion cooling system can reduce the noise to 40dB, but it is limited by sealing, load-bearing and node / server maintenance requirements, etc. High-density, cabinet-level immersion systems need to adopt a horizontal solution. Compared with traditional vertical cabinets, this solution It has the greatest impact on the layout of the computer room and the worst compatibility with traditional equipment

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  • Cooling cabinet with combination of liquid cooling and air cooling heat dissipation, and cooling system with combination of liquid cooling and air cooling heat dissipation
  • Cooling cabinet with combination of liquid cooling and air cooling heat dissipation, and cooling system with combination of liquid cooling and air cooling heat dissipation

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Embodiment Construction

[0035] In order to make the object, technical solution and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0036] It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are to distinguish two entities with the same name but different parameters or parameters that are not the same, see "first" and "second" It is only for the convenience of expression, and should not be construed as a limitation on the embodiments of the present invention, which will not be described one by one in the subsequent embodiments.

[0037] Based on the above purpose, the first aspect of the embodiments of the present invention proposes an embodiment of a cooling cabinet combining liquid cooling and air cooling for heat dissipation. figure 1 Shown is a perspective view of an emb...

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Abstract

The invention discloses a cooling cabinet with combination of liquid cooling and air cooling heat dissipation. The cooling cabinet comprises the following components: a cabinet body with a cabinet door; a liquid cooling server arranged in the cabinet body and connected with a main liquid inlet pipe and a main liquid outlet pipe; a first plate heat exchanger arranged on one side of the liquid cooling server and connected with a first liquid inlet pipe and a first liquid outlet pipe; a second plate heat exchanger arranged on the side, opposite to the first plate heat exchanger, of the liquid cooling server, wherein the second plate heat exchanger is connected with a second liquid inlet pipe and a second liquid outlet pipe; through-flow fans arranged on the two opposite sides of the liquid cooling server, so that heat generated by the liquid cooling server is transmitted to the first plate heat exchanger and the second plate heat exchanger to be cooled. The invention further discloses a cooling system. According to the cooling cabinet and the cooling system provided by the invention, the combination of liquid cooling and air cooling heat dissipation can be realized, and the heat dissipation efficiency is improved.

Description

technical field [0001] The invention relates to the field of heat dissipation, more specifically, to a cooling cabinet and a cooling system combining liquid cooling and air cooling for heat dissipation. Background technique [0002] Taking a certain type of domestic complete cabinet server (high temperature index is 35°C) as an example, its peak power consumption is 24kW, it adopts an open, air-cooled cooling scheme, and its maximum noise is 85dB. Limited by the noise level, 25kW is considered to be the heat dissipation limit of the open air-cooled architecture. With the improvement of system integration and system power consumption, the power consumption level of cabinets in typical scenarios such as high-performance computing and high-density deployment has increased to more than 30kW. [0003] As for the noise level, it is generally considered quiet and suitable below 40dB, 50-55dB is recommended for living and office conditions, and below 60dB is considered not to affec...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20736H05K7/20754H05K7/20781
Inventor 国林钊王雪李圣路
Owner SHANDONG CHAOYUE DATA CONTROL ELECTRONICS CO LTD