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Microwave device cavity, microwave device and antenna

A microwave device and cavity technology, applied in waveguide-type devices, antennas, electrical components, etc., can solve the problems of crushed welding parts, unfavorable welding, and circuit board shaking, etc., to reduce costs, improve stability, and ensure The effect of stability

Pending Publication Date: 2020-04-10
COMBA TELECOM TECH (GUANGZHOU) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because the cavity generally adopts the production method of pultrusion, a circuit board slot with a thickness of 0.2 mm cannot be formed in the cavity. When the circuit board is inserted into the circuit board slot, due to the difference in thickness between the circuit board and the slot Matching, there is a large gap between the circuit board and the inner wall of the card slot, and generally the circuit board needs to be centered in the card slot, so when the cable is soldered to the circuit board, the circuit board is prone to shaking, which is not conducive to welding, and because the circuit The plate is thin, and it is easy to be crushed at the welding part

Method used

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  • Microwave device cavity, microwave device and antenna
  • Microwave device cavity, microwave device and antenna
  • Microwave device cavity, microwave device and antenna

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Embodiment Construction

[0027] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0028] like figure 1 and figure 2 As shown, the present invention provides an antenna, including a microwave device 1, in this embodiment, the microwave device 1 is a phase shifter, in other embodiments, the microwave device 1 can also be a combiner or other devices. The microwave device 1 includes a cavity of the microwave device 1 and a circuit board 12 installed in the cavity of the microwave device 1 .

[0029] The cavity body of the microwave device 1 includes an inner cavity 111. In this embodiment, the cavity body of the micro...

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Abstract

The invention provides a microwave device cavity, a microwave device and an antenna. The microwave device cavity is suitable for installing a circuit board with a microwave circuit, and comprises an inner cavity, two opposite side walls of the inner cavity are provided with a first neck and a second neck, the first neck and the second neck face each other, the circuit board can be inserted into the first neck and the second neck, and the first neck is higher than the second neck, so that the lower plane of the first neck supports the back side of a pad. The first neck and a second neck are formed in the side wall of the inner cavity; a circuit board can be inserted into the inner cavity; for a thin circuit board, the heights of the first neck and the second neck are larger than the thickness of the circuit board, the first neck and the second neck are arranged in an up-down staggered mode, the lower plane of the first neck makes contact with the circuit board, the back side of the bonding pad of the circuit board is supported, and therefore the stability of the circuit board is improved when a cable is welded in a microwave device.

Description

technical field [0001] The invention relates to the technical field of mobile communication, in particular to a microwave device cavity, a microwave device and an antenna. Background technique [0002] At present, the cost pressure of base station antennas continues to increase, but the requirements for product stability are also increasing, and providing a low-cost and high-stability antenna has become a mainstream development trend. Among them, reducing the total cost of antenna products by reducing the thickness of the circuit board inside the phase shifter is one of the more common solutions, and the thickness of the circuit board can be reduced to 0.2mm. However, because the cavity generally adopts the production method of pultrusion, a circuit board slot with a thickness of 0.2 mm cannot be formed in the cavity. When the circuit board is inserted into the circuit board slot, due to the difference in thickness between the circuit board and the slot Matching, there is a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P1/18H01P1/213H01Q3/34
CPCH01P1/18H01P1/213H01Q3/34
Inventor 刘苑辉李明杰游建军杨仲凯
Owner COMBA TELECOM TECH (GUANGZHOU) CO LTD
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