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A wafer storage and turnover device

A technology for placing wafers and slots, applied in transportation and packaging, types of packaging items, special packaging items, etc., can solve problems such as wafer damage, and achieve the effect of avoiding collision damage

Active Publication Date: 2021-06-08
重庆梧桐栖凤机器人科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a wafer storage and turnover device, which aims to solve the problem that the wafer storage and transfer device in the prior art is to place the wafer in a box with a groove, cover it and place it in the transfer box, In this way, during the transfer process, the wafer slides in the box and collides with the inner wall of the box, which is easy to damage the technical problem of the wafer

Method used

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  • A wafer storage and turnover device
  • A wafer storage and turnover device
  • A wafer storage and turnover device

Examples

Experimental program
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Effect test

no. 1 example

[0026] see Figure 1 to Figure 3 , the present invention provides a wafer storage and turnover device 100, including a base 1, a closing cover 2, a resisting assembly 3 and a clamping assembly 4; the base 1 has a placement slot 11, and the placement slot 11 is located in the one side of the base 1 and extend into the interior of the base 1 , the closing cover 2 is slidably connected with the base 1 , and is matched with the placement slot 11 , and is located in the base 1 Inside, the closing cover 2 has a receiving groove 21 and a tooth slot 22, the receiving groove 21 is located on the side of the closing cover 2 close to the base 1 and faces away from the base 1 Protruding into the closing cover 2 and passing through the placing slot 11 , the wafer is placed between the placing slot 11 and the receiving slot 21 , and the tooth slot 22 is located in the closing cover 2 . The side wall of the accommodating groove 21 extends laterally into the interior of the closing cover 2 i...

no. 2 example

[0031] see Figure 1 to Figure 4 , the present invention provides a wafer storage and turnover device 100, including a base 1, a closing cover 2, a resisting assembly 3 and a clamping assembly 4; the base 1 has a placement slot 11, and the placement slot 11 is located in the one side of the base 1 and extend into the interior of the base 1 , the closing cover 2 is slidably connected with the base 1 , and is matched with the placement slot 11 , and is located in the base 1 Inside, the closing cover 2 has a receiving groove 21 and a tooth slot 22, the receiving groove 21 is located on the side of the closing cover 2 close to the base 1 and faces away from the base 1 Protruding into the closing cover 2 and passing through the placing slot 11 , the wafer is placed between the placing slot 11 and the receiving slot 21 , and the tooth slot 22 is located in the closing cover 2 . The side wall of the accommodating groove 21 extends laterally into the interior of the closing cover 2 i...

no. 3 example

[0039] see figure 1 , figure 2 , image 3 and Figure 5 , the present invention provides a wafer storage and turnover device 100, including a base 1, a closing cover 2, a resisting assembly 3 and a clamping assembly 4; the base 1 has a placement slot 11, and the placement slot 11 is located in the one side of the base 1 and extend into the interior of the base 1 , the closing cover 2 is slidably connected with the base 1 , and is matched with the placement slot 11 , and is located in the base 1 Inside, the closing cover 2 has a receiving groove 21 and a tooth slot 22, the receiving groove 21 is located on the side of the closing cover 2 close to the base 1 and faces away from the base 1 Protruding into the closing cover 2 and passing through the placing slot 11 , the wafer is placed between the placing slot 11 and the receiving slot 21 , and the tooth slot 22 is located in the closing cover 2 . The side wall of the accommodating groove 21 extends laterally into the interi...

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PUM

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Abstract

The invention discloses a wafer storage and turnover device. The closed cover plate protrudes from the placement groove in a direction away from the base, and at the same time, the closed cover plate drives the rotating gear to rotate axially, and drives and The transmission shaft fixed by the rotating gear rotates, and the clamping block rotates through the driving of the transmission shaft, and enters the tooth groove of the closing cover until the clamping block and the closing The end of the cover plate protruding into the placement slot is abutted, the wafer can be completely placed in the placement slot, abutted against the resisting assembly, and then the closed cover is driven into the placement slot, so that The clamping block is rotated to resist against the wafer, and the wafer is clamped and fixed, so that the wafer can be completely resisted in the placement groove of the base without displacement, and the collision damage between the wafer and the surrounding is avoided .

Description

technical field [0001] The invention relates to the field of wafer processing, in particular to a wafer storage and turnover device. Background technique [0002] In the current semiconductor process flow, although most of the devices or circuit chips are fabricated on the shallow surface layer of the semiconductor base material, in dozens or hundreds of process flows, in order to ensure the accuracy and structure of the wafer surface processing It is required and avoided to break the wafer during the process. Generally, a wafer of a certain thickness is used to transfer and tape out the wafer during the process. Due to the existence of parasitic resistance, the chip circuit will generate heat and the temperature will rise, and the different thermal expansion coefficients between the interconnecting metal and the semiconductor material, the semiconductor material and the packaging material will cause internal stress to cause the chip to crack or be damaged. Through the back...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65D25/10B65D85/30
CPCB65D25/10B65D85/30
Inventor 林涛马岗强杨毓军徐雪刚毛朝庆刘睿强卢静秦平辛邵华刘启飞赵文兵余仕平
Owner 重庆梧桐栖凤机器人科技有限公司