Electronic packaging structure and manufacturing method thereof
An electronic packaging and substrate technology, which is applied in the field of electronic packaging structure and its production, can solve the problems of difficult realization of liquid cooling method, increase heat dissipation structure, and difficulty in chips, and achieve the effects of avoiding electromagnetic interference, improving wiring density and reducing heat.
Active Publication Date: 2021-10-22
QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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Problems solved by technology
[0003] However, for the chip wafer process, limited by the chip process and manufacturing structure, it is difficult to add a heat dissipation structure inside the chip, so the liquid cooling method is difficult to achieve
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[0021] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with aspects of the invention as recited in the appended claims.
[0022] The terminology used in the present invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used herein and in the appended claims, the singular forms "a", "the", and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It should also be understood that the term "and / or" as use...
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The invention discloses an electronic package structure and a manufacturing method thereof, comprising: an upper substrate, a lower substrate, a micro-channel structure and a chip located between the upper substrate and the lower substrate; the micro-channel structure passes between the upper substrate and the lower substrate Wafer-level bonding is formed; the chip is metal-connected to the upper surface of the lower substrate through at least one first metal bump, and the chip is surrounded by the micro-channel structure; a non-metallized through hole of the lower substrate is connected to the micro-channel structure The inlet of the microfluidic channel is arranged correspondingly, and another non-metallized through hole of the lower substrate is arranged correspondingly with the outlet of the microfluidic channel. Liquid flows into the microfluidic channel through one non-metallized through-hole and then flows out through another non-metalized through-hole, effectively transferring heat away and improving the thermal characteristics of the entire package. In addition, the micro-channel structure also has electromagnetic shielding properties, which can effectively avoid external electromagnetic interference. Since the present invention adopts a wafer-level three-dimensional stacking structure, the wiring density of the system and the high-frequency characteristics of the entire package can be improved.
Description
technical field [0001] The invention relates to the technical field of electronic packaging, in particular to an electronic packaging structure and a manufacturing method thereof. Background technique [0002] Usually the heat dissipation of electronic components is achieved through the surrounding environment or heat sink. If the heat dissipation of electronic components is analyzed from the perspective of the thermal circuit, the power consumption is equal to the temperature difference divided by the thermal resistance. The greater the thermal resistance, the worse the heat dissipation capability of the electronic components. Then reducing the thermal resistance becomes an important aspect of the heat dissipation design of electronic components. Work. Generally speaking, the natural heat dissipation method is mainly suitable for electronic components that require less power for operation, do not require high temperature control, and the heat flux density of the device sho...
Claims
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IPC IPC(8): H01L23/31H01L23/473H01L23/552H01L21/56H01L23/485H01L21/60
CPCH01L21/56H01L23/3128H01L23/473H01L23/552H01L24/02H01L24/03H01L2224/0214H01L2224/02145H01L2224/0311H01L2224/16225H01L2224/73253H01L2924/15311
Inventor 王德信徐健陶源
Owner QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD