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A method and device for detecting temperature uniformity of parallel chips

A detection method and uniformity technology, applied in the field of parallel chip temperature uniformity detection, to achieve the effect of easy operation, simple measurement device and measurement method

Active Publication Date: 2022-04-29
GLOBAL ENERGY INTERCONNECTION RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, an embodiment of the present invention provides a method and device for detecting temperature uniformity of parallel chips to solve the technical problem in the prior art that the packaging structure of the module needs to be opened to measure the temperature uniformity of parallel chips in the module

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  • A method and device for detecting temperature uniformity of parallel chips
  • A method and device for detecting temperature uniformity of parallel chips
  • A method and device for detecting temperature uniformity of parallel chips

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Embodiment 1

[0027] An embodiment of the present invention provides a method for detecting temperature uniformity of parallel chips, such as figure 1 As shown, the detection method includes the following steps:

[0028] Step S101: Put the module under test in working state at multiple preset temperatures, and calculate the shutdown time and shutdown delay time of the module under test under the preset temperatures. The module under test includes multiple chips connected in parallel.

[0029] Wherein, multiple preset temperatures can be set according to actual needs and device manuals provided by device manufacturers. For example, the preset temperature can be started from 30°C, with 10°C as the unit, at the preset temperature of 30°C, it can be increased sequentially to obtain 40°C, 50°C, 60°C, 70°C, 80°C, 90°C, 100°C, 110°C , 120°C, 130°C, 140°C, 150°C and other preset temperatures. It should be noted that the maximum value of the preset temperature cannot exceed the specified value in t...

Embodiment 2

[0043] An embodiment of the present invention provides a parallel chip temperature uniformity detection device, such as Figure 5 As shown, the detection device includes a voltage source 1, a data acquisition instrument 3, a thermostat 4 and a microprocessor 5, the voltage source 1 is used to supply power to the module to be tested 2, so that the module to be tested is in a working state, and the module to be tested 2 includes a plurality of chips connected in parallel; the thermostat 4 is used to control the temperature of the module to be tested 1; the data acquisition instrument 3 is used to measure the shutdown time and the shutdown delay time of the module to be tested 2 at a preset temperature and the working environment The off-time measurement value and the off-delay time measurement value; the microprocessor 5 is connected to the data acquisition instrument 3 and the thermostat 4, and is used to calculate the off-time according to the off-time and off-delay time at the...

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Abstract

The invention discloses a method and device for detecting temperature uniformity of parallel chips. The detection method includes the following steps: placing a module to be tested in a working state at a plurality of preset temperatures, and calculating the temperature of the module to be tested at a plurality of preset temperatures. The turn-off time and turn-off delay time, the module to be tested includes multiple chips connected in parallel; the turn-off time curve and the turn-off delay time curve are calculated according to the turn-off time and turn-off delay time at multiple preset temperatures; The module to be tested is placed in the working environment, and the measured value of the off-time and the off-delay time of the module to be tested are calculated; the off-time is calculated according to the measured value of the off-delay time, the off-time curve and the off-delay time curve Calculated value; judge the temperature uniformity of the module under test according to the off-time measured value and off-time calculated value. By implementing the invention, the non-destructive detection of temperature uniformity can be realized, and meanwhile, the measuring device and the measuring method are simple and easy to operate.

Description

technical field [0001] The invention relates to the technical field of electronic device testing, in particular to a method and device for detecting temperature uniformity of parallel chips. Background technique [0002] Parallel connection of chips is an effective way to increase the output current of large-capacity converters. However, differences in heat dissipation conditions will lead to uneven temperature of parallel chips in IGBT or MOS modules, affecting module characteristics and reliability, and even overheating the module in severe cases. And burned. Detecting the uniformity of chip temperature in IGBT or MOS module parallel chips is of great significance to application circuit design and chip array arrangement. [0003] At present, the methods for detecting the temperature of parallel chips mainly include infrared method and electrical method. Among them, the infrared method can measure the surface temperature distribution of the IGBT or MOS module, but this me...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/26G01K13/00
CPCG01R31/2601G01R31/2619G01K13/00
Inventor 李尧圣李翠杜玉杰刘颖含郭春生王思晋
Owner GLOBAL ENERGY INTERCONNECTION RES INST CO LTD