Unlock instant, AI-driven research and patent intelligence for your innovation.

Electronic equipment

A technology for electronic equipment and circuit boards, which is applied to structural components of electrical equipment, electrical components, magnetic field/electric field shielding, etc., and can solve problems such as unbalanced, unsatisfactory heat dissipation solutions, and scattered heat sources

Active Publication Date: 2022-04-01
SZ DJI TECH CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional heat dissipation solutions cannot meet the heat dissipation requirements of industrial-grade aircraft (high power consumption, harsh environment, scattered heat sources for chips, but the structure is relatively spacious compared to small UAVs)
Especially for customized drones, the use of modular design makes the heat source more dispersed and cannot be taken into account)

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic equipment
  • Electronic equipment
  • Electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] Embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary, are only for explaining the present application, and should not be construed as limiting the present application.

[0038] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the application and simplifying the description, and doe...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An electronic device (100), comprising a housing (10), a heat dissipation assembly (20) and a circuit board (30), the housing (10) is provided with an air inlet (111), an air outlet (121) and a communication inlet (111) and the air duct (13) of the air outlet (121), the cooling assembly (20) and the circuit board (30) are positioned in the air duct (13), and the cooling assembly (20) includes a cooling fin (21), a circuit board ( 30) a first heat source (31) and a second heat source (32) are provided, the heat sink (21) includes an upper surface (211) and a lower surface (212), the first heat source (31) is located on the upper surface (211) and is connected to The heat sink (21) is connected with heat conduction, and the second heat source (32) is located on the lower surface (212) and connected with the heat sink (21) with heat conduction.

Description

technical field [0001] The present application relates to the technical field of electronic equipment, and more specifically, relates to an electronic equipment. Background technique [0002] Generally, electronic devices, such as drones, are provided with cooling structures to dissipate heat from chips, motherboards or other heat-generating components in the drone, thereby ensuring the normal operation of the drone. For consumer drones, due to the relatively low ambient temperature, the requirements for image transmission and algorithms are relatively small, the chip power consumption is relatively small, and due to the limitation of structural size, centrifugal fans and heat sinks are often used for thermal design. This heat dissipation scheme has a good effect on small UAVs, but the application of UAVs in various fields has gradually deepened. Industrial-grade drones that need to operate under various harsh environmental conditions put forward higher requirements for he...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H05K9/00
CPCH05K7/20145H05K7/20154H05K7/205H05K7/20172H05K9/0024H05K7/20H05K9/00
Inventor 王超瑞才志伟丘力
Owner SZ DJI TECH CO LTD