Modular heat dissipation structure and LED lighting device thereof

Abstract

The invention discloses a modular heat dissipation structure. The modular heat dissipation structure comprises a power source box and a radiator, the power source box is used for containing a power source and dissipating heat of the power source, the radiator is used for dissipating heat of a light source, and the modular heat dissipation structure is characterized in that a first lapping part isarranged on the radiator, and a second lapping part is arranged on the power source box; and the first lapping part is lapped on the second lapping part. The invention further discloses an LED lighting device which is provided with the modular heat dissipation structure. The modular heat dissipation structure and the LED lamp is convenient to install, high in safety performance in the using process and good in heat dissipation performance, the influence of heat of the light source on the power source is small, and the overall service life of the power source and the lighting device is prolonged.

Description

technical field [0001] The invention discloses a modular heat dissipation structure and an LED lighting device thereof, belonging to the field of LED lighting. Background technique [0002] In the field of LED lighting, the heat dissipation performance of lighting fixtures greatly affects the service life of the lighting fixtures. Therefore, industry technicians have never stopped researching, developing and improving the heat dissipation structure. [0003] The heat sources of LED lamps mainly include the following two aspects: one is the heat generated when the LED lamp beads emit light; the other is the heat generated when the lamp power supply is working. Among them, the heat generated by the LED lamp bead is greater than the heat generated by the lamp power supply when it is working, and the heat of the LED lamp bead is dissipated through a specially set radiator, and the heat of the power supply is dissipated through the power supply case. In the previous heat dissipa...

AI Technical Summary

Problems solved by technology

In the previous heat dissipation structure of lamps and lanterns, the power shell and the radiator are in direct contact, so a large amount of heat will be transferred from the radiator to the power shell, so that the heat on the power shell is much greater than the heat of the power supply itself, thus shortening life of the power supply

[0004] In addition, the traditional LED high-bay lights share a heat sink for the power supply and light source, the installation method is single, and the heat dissipation efficiency is low. Therefore, some high-bay lights on the market have made some improvements to address the above defects.

For example, the Chinese patent application number is CN21621124141.5 for a new type of high-bay lamp invention patent, which discloses a heat dissipation structure in which the power supply and light source are separated to dissipate heat, which can effectively avoid the problem of low heat dissipation caused by the power supply and light source sharing the heat dissipation structure; However, the power supply box is fixed on the upper side of the cooling plate by locking screws from the upper side. Since the mounting parts of the high bay lamp are also arranged on the power supply box, this causes the power supply box to be damaged during daily use. The connecting screw with the cooling plate needs to bear a lot of weight. When the screw teeth are damaged, it is easy to cause the cooling plate of the high-bay lamp and the parts below to fall, which will bring safety hazards

In fact, at present, most of the lighting products such as high-bay lights and industrial and mining lights that adopt the above split design on the market also adopt the installation method of the power supply box on the top and screw connection and fixing, so the above-mentioned existence is unavoidable. question

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