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3d3c-vsp imaging processing method, device and equipment

A technology of imaging processing and migration imaging, which is applied in measurement devices, seismic signal processing, geophysical measurement, etc. It can solve the problems of inaccurate iso-velocity fields at both ends of the imaging section and poor hyperbolic characteristics of the gathers of common imaging points.

Active Publication Date: 2020-12-22
CHINA UNIV OF GEOSCIENCES (BEIJING)
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the three-dimensional three-component (3D3C) vertical seismic profile (VSP) imaging process, after the common imaging point gather is generated based on the initial velocity model, due to the poor hyperbolic characteristics of the generated common imaging point gather, if the common imaging point gather is generated directly When the gather is used for migration imaging, there will be problems caused by the inaccurate velocity field such as "upturning" at both ends of the imaging section and divergence of the event axis.

Method used

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Embodiment 1

[0056] figure 1 Schematic flow chart of the 3D3C-VSP imaging processing method provided for the embodiment of this specification Figure 1 , this method can be applied in the related technical fields of 3D3C-VSP, such as image 3 As shown, the 3D3C-VSP imaging processing method includes the following steps:

[0057] S102, using the VSP initial velocity model to obtain the travel time of the seismic wave for the three-dimensional three-component VSP data to be imaged, correcting the travel time of the seismic wave to the self-excitation and self-receiving time of the seismic wave, and extracting multiple first common imaging points of the seismic wave set;

[0058] In the conventional common image point gather extraction process based on the VSP initial velocity model, such as figure 2 As shown, the shot point S excites seismic waves, and the seismic waves are scattered at the underground imaging point O (scattering point O for short), and are received by the underground re...

Embodiment 2

[0078] This embodiment is on the basis of embodiment one, to figure 1 The shown 3D3C-VSP imaging processing method is extended and supplemented.

[0079] Figure 4 Schematic flow chart of the 3D3C-VSP imaging processing method provided for the embodiment of this specification Figure II , step 108 is refined in this method, that is, the above step 108 may specifically include:

[0080] S108-2, keep the offset of the seismic wave unchanged, translate the shot point and receiver point to the pseudo-shot point and pseudo-receiver point on the surface, and project the pseudo-shot point and pseudo-receiver point to the imaging point of the seismic wave on the surface the distance is equal;

[0081] Specifically, such as image 3 As shown in , let the SR distance be x, keep the distance between SRs constant, and translate the SR to the detector side to S"R", where S" and R" are the pseudo-shot point and pseudo-receiver point respectively. C is the midpoint of S"R", and S"C=R"C=...

Embodiment 3

[0106] corresponding to the above figure 1 , Figure 4 , Figure 5 The described 3D3C-VSP imaging processing method is based on the same technical idea, and the embodiment of this specification also provides a 3D3C-VSP imaging processing device. Figure 8 A schematic diagram of the module composition of the 3D3C-VSP imaging processing device provided by the embodiment of this specification, which is used to execute figure 1 , Figure 4 , Figure 5 Describe the 3D3C-VSP imaging processing method as Figure 8 As shown, the device includes: gather extraction module 201, gather judgment module 202, imaging processing module 203 and reaction correction module 204;

[0107] The gather extraction module 201 uses the VSP initial velocity model to obtain the seismic wave travel time for the three-dimensional three-component VSP data to be processed, corrects the seismic wave travel time to the self-excitation and self-reception time of the seismic wave, and extracts multiple first...

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Abstract

The embodiment of the invention provides a 3D3C-VSP imaging processing method, device and equipment. The method comprises the steps of using a VSP initial speed model for three-dimensional three-component VSP data to be imaged to obtain seismic wave travel time, correcting the seismic wave travel time dynamically to self-excitation and self-receiving time of seismic waves, and obtaining a plurality of first common imaging point gathers of the seismic waves through extraction; judging whether the event of the first common imaging point gather is leveled or not; if so, superposing the first common imaging point gathers to obtain a migration imaging profile of seismic waves; and if not, reversely correcting the seismic wave travel time of the first common imaging point gather to the hyperbolic travel time of the pseudo-offset common imaging point gather to obtain the pseudo-offset common imaging point gather with hyperbolic time-distance characteristics, and obtaining an offset imaging profile of the seismic wave based on the pseudo-offset common imaging point gather. According to the scheme of the embodiment of the invention, the problems of upwarping and event divergence of the twoends of the imaging profile can be effectively reduced, so that the overall imaging quality of the imaging profile is improved.

Description

technical field [0001] This document relates to the field of VSP seismic exploration, in particular to a 3D3C-VSP imaging processing method, device and equipment. Background technique [0002] In the three-dimensional three-component (3D3C) vertical seismic profile (VSP) imaging process, after the common imaging point gather is generated based on the initial velocity model, due to the poor hyperbolic characteristics of the generated common imaging point gather, if the common imaging point gather is generated directly When the gather is used for migration imaging, there will be problems caused by the inaccurate velocity field such as "upturning" at both ends of the imaging section and divergence of the event axis. Contents of the invention [0003] The embodiment of this specification provides a 3D3C-VSP imaging processing method, device and equipment, which can effectively reduce the problems of “upturning” at both ends of the imaging section and divergence of events, ther...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01V1/48G01V1/50
CPCG01V1/48G01V1/50G01V2210/6169G01V2210/74
Inventor 芦俊王赟
Owner CHINA UNIV OF GEOSCIENCES (BEIJING)