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Side clamping jig of electronic module and using method thereof

A technology of electronic modules and fixtures, applied in the direction of electrical components, electrical components, etc., can solve the problems of small dimensions (below 12mm*12mm, and the inability to realize SMT2 process, etc.), achieve good printing, improve production efficiency, and improve product quality. rate effect

Active Publication Date: 2020-06-05
HUANWEI ELECTRONICS SHANGHAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, for a single electronic module with a large size, the SMT process can be carried out by vacuum adsorption on the bottom surface and surface fixture pressing and fixing, but for a small single electronic module If it is too close to be fixed by tape or the middle of the electronic module adopts a hollow design, the existing jig will not be able to realize the SMT2 process, so it is necessary to design a new jig to fix the electronic module and complete the SMT2 process

Method used

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  • Side clamping jig of electronic module and using method thereof
  • Side clamping jig of electronic module and using method thereof
  • Side clamping jig of electronic module and using method thereof

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Embodiment Construction

[0053] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the specific implementation manners of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention, and those skilled in the art can obtain other accompanying drawings based on these drawings and obtain other implementations.

[0054] In order to make the drawing concise, each drawing only schematically shows the parts related to the present invention, and they do not represent the actual structure of the product. In addition, to make the drawings concise and easy to understand, in some drawings, only one of the components having the same structure or function is schematically shown, or only one of them is marked. Herein, "a" not only means "only one", but also means "more than one".

[0055] According ...

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Abstract

The invention provides a side clamping jig of an electronic module and a using method thereof. The side clamping jig of the electronic module comprises a base, wherein the base is provided with a placement groove, and one end, close to the placement groove, of the base is provided with a driving device; a jig body, wherein the jig body is arranged in the placement groove of the base, the driving device drives the jig body to move, the jig body is provided with a plurality of first grooves distributed in an array mode and second grooves communicating with the first grooves, wherein a pluralityof first magnets are embedded in the bottoms of the first grooves, and the second grooves are used for containing electronic modules; multiple sliding modules placed in the first grooves and can slide in the first grooves, wherein a plurality of second magnets are embedded in the sliding modules; the first magnet and the second magnet attract each other, and when the external force is removed, the sliding module and the side wall of the second groove clamp the electronic module.

Description

technical field [0001] The invention relates to a fixing jig for an electronic module, especially a side clamping jig for an electronic module in an SMT process, and a method for using the same. Background technique [0002] In order to achieve miniaturization and safe and reliable performance, today's wearable electronic products mostly use double-sided SMT process, that is, the first side is the multi-board SMT process, and the second side is to first cut the multi-board electronic module A into individual Electronic modules, and then carry out the second-side SMT2 process. At present, for a single electronic module with a large size, the SMT process can be carried out by vacuum adsorption on the bottom surface and surface fixture pressing and fixing, but for a small single electronic module If it is too close to be fixed by tape or if the middle of the electronic module adopts a hollow design, the existing jig will not be able to realize the SMT2 process, so it is necess...

Claims

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Application Information

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IPC IPC(8): H05K13/04
CPCH05K13/0404H05K13/046
Inventor 许海涛
Owner HUANWEI ELECTRONICS SHANGHAI CO LTD