Substrate crack detection method and system and storage medium

Abstract

The invention provides a substrate crack detection method and system and a storage medium. The substrate crack detection method comprises a sending step, a database establishment step, an acquisitionstep, a comparison step and an interception step. Amplitude comparison is performed on the acquired periodic waveform of each row of gridlines of a substrate and a standard periodic waveform; and if the amplitude difference exceeds a preset value, the substrate crack is determined, and then an alarm signal is sent, the production work of the substrate is stopped, the cracked substrate is intercepted, so that the situation that the subsequent substrate flows in to pollute a machine table, and consequently the productivity is affected is avoided.

Description

technical field [0001] The present invention relates to the technical field of panel detection, in particular to a method and system for detecting substrate cracks, and a storage medium. Background technique [0002] During the panel production process, the substrate will have cracks due to various reasons and is not completely broken. After entering the main process machine, it will be broken when it goes through high temperature and high pressure or the substrate is reversed. This will pollute the process machine and cause great losses. [0003] Therefore, by analyzing the waveform of the disconnection and short-circuit tester (OST) each time a fragment occurs in the rear section, it is found that the waveform of the cracked substrate is significantly different from that of the normal substrate, but there is no alarm for the waveform at the crack that cannot be identified by the machine at present, thus causing The substrate is broken in subsequent processes. Contents of...

AI Technical Summary

Problems solved by technology

[0002] During the panel production process, the substrate will be cracked due to various reasons and not completely broken. After entering the main process machine, it will be broken when it goes through high temperature and high pressure or the substrate is reversed. This will pollute the process machine and cause great losses.

[0003] Therefore, by analyzing the waveform of the disconnection and short-circuit tester (OST) each time a fragment occurs in the rear section, it is found that the waveform of the cracked substrate is significantly different from that of the normal substrate, but there is no alarm for the waveform at the crack that cannot be identified by the machine at present, thus causing The substrate is broken in the subsequent process

Images