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Small-spacing BGA automatic wire outgoing method and device

A small-pitch, automatic technology, applied in the manufacturing of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of long design cycle, complicated wiring methods, and low design efficiency.

Active Publication Date: 2020-07-07
ZHEJIANG UNIVIEW TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] As the demand for miniaturization of consumer products is getting higher and higher, board-level PCB design also brings greater challenges, especially as the design cycle of main control chip BGA becomes longer, and the requirements for outlet strategies are higher. Current consumer products Small-pitch BGAs are more frequently used in China. Due to the smaller pin pitch, the traditional four-sided fan-out method can no longer meet the normal wiring requirements. Therefore, the wiring methods that need to be considered are more complicated, and it also puts forward higher requirements for designers.
[0003] The BGA outlet method commonly used in the industry takes the center of the device as the axis, and the four sides are respectively fanned out to the outside, and the outer two circles of the surface layer are used for outlets. This outlet strategy can meet the requirements for BGAs above 0.8mmPITCH. There are obvious shortcomings in the fine-pitch BGA outlets, so in The small-pitch BGA outlets are still manually completed by the designer, and the design efficiency is low

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  • Small-spacing BGA automatic wire outgoing method and device
  • Small-spacing BGA automatic wire outgoing method and device
  • Small-spacing BGA automatic wire outgoing method and device

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Embodiment 1

[0065] see figure 1 , this embodiment provides an automatic wiring method for small-pitch BGAs. The automatic wiring method for small-pitch BGAs provided by this embodiment can shorten the design cycle, reduce labor costs, and improve wiring efficiency.

[0066] The small-pitch BGA automatic wire-out method provided in this embodiment is mainly used for BGAs below 0.8 mm, which can ensure that small-pitch BGAs can be wire-out normally, shorten the design cycle, reduce labor costs, and improve wire-out efficiency.

[0067] Specific steps are as follows:

[0068] see figure 1 , step S100 , formulate routing strategies for multiple pins according to the pre-acquired pin list. Wherein, the pins include lead pins and power pins.

[0069] In this embodiment, the pin list of the BGA is obtained first, and the routing strategy for the pins in the pin list is formulated according to the pin list of the BGA.

[0070] In this embodiment, before formulating the routing strategy, the f...

Embodiment 2

[0114] see Figure 7 , this embodiment provides a small-pitch BGA automatic wiring device 10, the small-pitch BGA automatic wiring device 10 provided in this embodiment can shorten the design cycle, reduce labor costs, and improve wiring efficiency.

[0115] For a brief description, reference may be made to Embodiment 1 for parts not mentioned in this embodiment.

[0116] In the present invention, the small-pitch BGA automatic outlet device 10 includes:

[0117] The strategy module 100 is configured to formulate routing strategies for multiple stitches according to the pre-acquired stitch list.

[0118] In the embodiment of the present invention, step S100 may be executed by the policy module 100 .

[0119] The routing module 200 is configured to route a plurality of lead stitches in the stitch list according to the routing strategy, wherein the plurality of lead stitches are arranged in a matrix.

[0120] In the embodiment of the present invention, step S200 may be execute...

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Abstract

The invention provides a small-spacing BGA automatic wire outgoing method and device, and relates to the field of electronic equipment. The small-spacing BGA automatic wire outgoing method comprises:formulating a wiring strategy according to a pre-acquired pin list, and routing the plurality of pins in the pin list according to a routing strategy, the plurality of pins being arranged in a matrix.According to the small-spacing BGA automatic wire outgoing method provided by the invention, the design period can be shortened, the labor cost can be reduced, and the wire outgoing efficiency can beimproved.

Description

technical field [0001] The invention relates to the field of electronic equipment, in particular to a small-pitch BGA automatic wiring method and device. Background technique [0002] As the demand for miniaturization of consumer products is getting higher and higher, board-level PCB design also brings greater challenges, especially as the design cycle of main control chip BGA becomes longer, and the requirements for outlet strategies are higher. Current consumer products Small-pitch BGAs are more frequently used in China. Due to the smaller pin pitch, the traditional four-sided fan-out method can no longer meet the normal wiring requirements. Therefore, the wiring methods that need to be considered are more complicated, and it also puts forward higher requirements for designers. . [0003] The BGA outlet method commonly used in the industry takes the center of the device as the axis, and the four sides are respectively fanned out to the outside, and the outer two circles o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60
CPCH01L24/11H01L24/742H01L2224/119H01L2224/742
Inventor 张立辉
Owner ZHEJIANG UNIVIEW TECH CO LTD
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