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Cooling device for adhesive production

A technology for cooling devices and adhesives, which is applied in cooling fluid circulation devices, household refrigeration devices, coolers, etc., and can solve problems such as insufficient efficiency and wasted time

Inactive Publication Date: 2020-07-17
宋湛花
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] During the manufacturing process of the adhesive, it needs to be cooled, and then the material is taken out for the next step of processing. Nowadays, the adhesive is usually placed in the storage tank for natural cooling. This method is not efficient enough. It will waste a lot of time, so there is an urgent need for a viscose production cooling device with high cooling efficiency

Method used

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  • Cooling device for adhesive production
  • Cooling device for adhesive production
  • Cooling device for adhesive production

Examples

Experimental program
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Effect test

Embodiment 1

[0021] see Figure 1~3 , in an embodiment of the present invention, a cooling device for adhesive production, including a cooling main body 18, the cooling main body 18 is connected to the cooling upper cover 1 through a connecting mechanism, and the setting of the cooling main body 18 and the cooling upper cover 1 is convenient for users To clean the inside of the cooling main body 18, the specific form of the connecting mechanism is not limited. In this embodiment, preferably, the connecting mechanism includes a connecting piece 2, and one end of the cooling main body 18 and the cooling upper cover 1 passes through the connecting piece 2 connection, in this embodiment, preferably, the connecting piece 2 is a hinge, the cooling main body 18 is provided with a connecting plate 15, and the cooling upper cover 1 is provided with a connecting plate 2 16, and the connecting plate The first 15 and the connecting plate two 16 are connected by screws 17 and bolts 14, and the cooling ...

Embodiment 2

[0027] In order to further enhance the cooling capacity of the viscose production cooling device, this embodiment makes the following improvements on the basis of Embodiment 1. The improvement is that a heat conduction block 20 is fixedly arranged on the cooling main body 18, by setting The heat conduction block 20 guides the heat of the adhesive in the cooling body 18 to the outside to dissipate heat. In this embodiment, preferably, the heat conduction block 20 is an aluminum block.

[0028] The working principle of this embodiment is: the cooling body 18 is fixedly provided with a heat conduction block 20 , and by setting the heat conduction block 20 , the heat of the adhesive in the cooling body 18 is directed to the outside to dissipate heat.

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Abstract

The invention discloses a cooling device for adhesive production. A first cooling mechanism and a second cooling mechanism are arranged in a cooling main body; the first cooling mechanism comprises afirst power device, the two ends of the first power device are both connected with a gas delivering pipe, one end of the gas delivering pipe is connected with the outside, and the other end of the gasdelivering pipe extends to the lower end in the cooling main body; the second cooling mechanism comprises a second power device and a cooling device body, the second power device and the cooling device body are connected through a liquid delivering straight pipe, and the other ends of the second power device and the cooling device body are also connected with the liquid delivering straight pipe;a liquid delivering spiral pipe is further included, and the two ends of the liquid delivering spiral pipe are both connected with the liquid delivering straight pipe; a circulating cooling mechanismis further arranged on the cooling main body and comprises a third power device, and the two ends of the third power device are connected with the cooling main body and a discharging pipe through circulating liquid delivering pipes; and a temperature display instrument is further included, a heat conducting block is fixedly arranged on the cooling main body, and by arranging the heat conducting block, heat of an adhesive in the cooling main body is conducted to the outside for heat dissipation.

Description

technical field [0001] The invention relates to the field of adhesive processing equipment, in particular to a cooling device for adhesive production. Background technique [0002] Adhesive bonding (gluing, bonding, cementing, gluing) refers to the technology of connecting the surfaces of homogeneous or heterogeneous objects with adhesives, which has the characteristics of continuous stress distribution, light weight, or sealing, and low temperature in most processes. , Adhesive bonding is especially suitable for the connection of different materials, different thicknesses, ultra-thin specifications and complex components. There are many classification methods of adhesives, which can be divided into thermosetting type, hot melt type, room temperature curing type and pressure sensitive type according to the application method. etc.; According to the application object, it is divided into structural type, non-configuration or special glue; the bonding form can be divided into ...

Claims

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Application Information

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IPC IPC(8): F25D15/00F25D17/02F25D29/00
CPCF25D15/00F25D17/02F25D29/001
Inventor 宋湛花
Owner 宋湛花