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Heat dissipation device

A technology of heat dissipation device and heat dissipation base, which is applied in the direction of indirect heat exchanger, heat exchange equipment, heat exchanger fixation, etc.

Active Publication Date: 2020-07-31
NANNING FUGUI PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional heat sinks are no longer able to efficiently remove heat from the CPU

Method used

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0021] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a centered component at the same time. When a component is said to be "set on" another component, it can be set directly on another component or there may be a centered component at the same time.

[0022] Unless otherwise defined, all technical and scientific terms used herein h...

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PUM

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Abstract

The invention provides a heat dissipation device, which comprises a heat dissipation base, a plurality of guide pipes and a driving assembly, wherein the guide pipe sequentially comprises an inlet end, an extension structure and an outlet end, the extension structure is connected with the heat dissipation base, the driving assembly comprises a shell, a partition piece and two electromagnetic driving pieces, the partition piece is arranged in the shell and defines a first cavity and a second cavity in the shell so as to store a cooling liquid, the partition piece is of a thin plate structure and comprises a magnetic assembly, the two electromagnetic driving pieces are opposite to the partition piece and are arranged on the two sides of the shell, the first cavity and the second cavity are respectively connected with the inlet end and the outlet end of at least one of the guide pipes so as to respectively guide the cooling liquid to leave the first cavity and the second cavity and flow into the first cavity and the second cavity.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device with a cooling liquid driving unit. Background technique [0002] When an electronic device (for example, a computer CPU) operates, a large amount of heat energy is usually generated, and the heat energy must be removed from the CPU quickly to prevent the CPU from being unstable or damaged. Generally speaking, a heat sink is attached to the surface of the CPU to absorb heat from the CPU. The thermal energy absorbed by the heat sink is then dissipated by the ambient air. [0003] Traditionally, the heat dissipation device includes a metal base mounted on a CPU, and a plurality of fins formed on the base. The substrate is attached to the CPU and must be sufficiently cooled to ensure proper operation of the CPU. Most of the thermal energy accumulated on the substrate is first transferred to the fins and then dissipated by the fins. However, as electronic tec...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/473G06F1/20
CPCH01L23/473H01L23/3672G06F1/20F28D2015/0216H10N10/13F28F2250/08F28D15/00F04B7/0076F28F2275/22
Inventor 肖代革
Owner NANNING FUGUI PRECISION IND CO LTD