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heat sink

A technology of heat dissipation device and heat dissipation base, which is applied in the direction of indirect heat exchanger, heat exchange equipment, heat exchanger fixation, etc., to achieve the effect of controlling heat dissipation efficiency

Active Publication Date: 2022-05-31
NANNING FUGUI PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional heat sinks are no longer able to efficiently remove heat from the CPU

Method used

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Experimental program
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Embodiment Construction

[0021] It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to another

[0025] FIG. 3 shows a longitudinal cross-sectional view of the heat sink 1 of FIG. 1 . In one embodiment, the long axis direction of the cylinder 11 (Z axis direction

[0026] In one embodiment, as shown in FIG. 3 , the plurality of channels 115 extend in the column parallel to the long axis direction L (Z axis direction).

[0027] FIG. 4 shows an exploded view of the drive assembly 30 according to an embodiment of the present invention. In one embodiment, the drive group

[0028] The partition 34 is disposed in the casing 31 and defines a first cavity 311 and a second cavity 312 in the casing 31

[0029] In one embodiment, the spacer 34 includes a magnetic component. The thin plate structure of the spacer 34 can be controlled by the magnetic assembly

[0030] The first electromagnetic drive member 35 and the second electromagnetic drive...

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PUM

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Abstract

The invention proposes a heat dissipation device, comprising: a heat dissipation base, a plurality of conduits, and a driving assembly. The conduit sequentially includes an inlet port, an extension structure, and an outlet port. The extension structure is connected to the heat dissipation base. The driving assembly includes: a housing, a partition and two electromagnetic driving parts. The partition is arranged in the shell and defines a first cavity and a second cavity in the shell to store the cooling liquid, wherein the partition is a thin plate structure and includes a magnetic component. The two electromagnetic driving parts are opposite to the partition part and arranged on two sides of the casing. The first cavity and the second cavity are respectively connected to the inlet end and the outlet end of at least one of the conduits, so as to respectively guide the cooling liquid to leave the first cavity and the second cavity and flow into the first cavity and the second cavity body.

Description

heat sink technical field [0001] The present invention relates to a heat sink, particularly a heat sink with a cooling liquid drive unit. Background technique [0002] When an electronic device (eg, a computer central processing unit) operates, a large amount of thermal energy is usually generated, which must be It must be removed from the CPU quickly to avoid instability or damage to the CPU. Generally speaking, the surface of the CPU A heat sink is usually attached to absorb the heat energy from the central processing unit. The heat energy absorbed by the heat sink is then passed through the ring ambient air to disperse. Traditionally, the heat sink includes a metal base attached to the central processing unit, and a plurality of fins formed on the base. above the bottom. The substrate is in close contact with the CPU and must be cooled sufficiently to ensure proper operation of the CPU. mostly in The thermal energy accumulated on the substrate is first trans...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L23/473G06F1/20H10N10/13
CPCH01L23/473H01L23/3672G06F1/20F28D2015/0216H10N10/13F28F2250/08F28D15/00F04B7/0076F28F2275/22
Inventor 肖代革
Owner NANNING FUGUI PRECISION IND CO LTD