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A method of heat transfer and heat dissipation with large heat and high heat flux based on high-dimensional thermoelectricity

A technology with high heat flux density and heat dissipation method, applied in the direction of machine operation, machines using electric/magnetic effects, temperature control using digital devices, etc., can solve the problem of heat transfer efficiency of heat pipe technology, limited transmission distance, and unsatisfactory products Structural requirements, low working temperature range, etc., to achieve the effect of ensuring cleanliness and humidity, high cost performance, and small changes

Active Publication Date: 2021-02-26
SHENZHEN JIANJU SCI & TECH LTD
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Problems solved by technology

[0003] Although this technology is commonly used, it is limited by boiling limit, carrying limit, condensation limit, continuous flow limit, cold start limit and other reasons. The heat transfer efficiency and transmission distance of heat pipe technology are relatively limited, and the working temperature range is low. It is also relatively fixed and cannot meet the needs of various product structures. Therefore, the present invention proposes a method of heat transfer and heat dissipation with large heat and high heat flux based on high-dimensional thermoelectricity to solve the problems existing in the prior art

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  • A method of heat transfer and heat dissipation with large heat and high heat flux based on high-dimensional thermoelectricity

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Embodiment Construction

[0012] In order to deepen the understanding of the present invention, the present invention will be further described below in conjunction with the examples, which are only used to explain the present invention, and do not constitute a limitation to the protection scope of the present invention.

[0013] according to figure 1 As shown, this embodiment provides a method for heat transfer and heat dissipation with large heat and high heat flux density based on high-dimensional thermoelectricity, including a high-dimensional heat dissipation matrix, a time synchronization constraint module, a thermoelectric cooling chip, a temperature data acquisition / transmission module, and a temperature detector , control / temperature measurement module, heat transfer channel and external power measurement signal module, the temperature data acquisition / transmission module collects and transmits the real-time temperature data on the temperature detector in real time, and the control / temperature ...

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Abstract

The invention discloses a method for heat transfer and heat dissipation with large heat and high heat flux density based on high-dimensional thermoelectricity. The temperature data acquisition / transmission module collects and transmits the real-time temperature data on the temperature detector in real time, and the control / temperature measurement module integrates the temperature detector. The time is modified in real time, the heat transfer channel in the control / temperature measurement module outputs accurate temperature signals for the collected temperature data, the external power measurement signal module analyzes and compares the output accurate temperature signals, and the high-dimensional heat dissipation matrix passes time synchronization constraints module to realize the large-area distribution control of 1~n groups of thermoelectric cooling chips; as a system-level precise temperature control technology, the present invention realizes a heat flux greater than 10^6W / cm2, a heat transfer distance of more than hundreds of meters, and a laboratory stage Precise control -196°C to 1200°C, the temperature difference between the head end and the end product is only 0.5°C, and the heat dissipation structure design can be customized.

Description

technical field [0001] The invention relates to the technical field of heat pipe heat dissipation, in particular to a method for heat transfer and heat dissipation with large heat and high heat flux based on high-dimensional thermoelectricity. Background technique [0002] Temperature control is widely used in electrical appliances, food refrigeration, cold chain logistics, industrial production, medical treatment and daily life. In the current technology, Freon and heat pipes are more commonly used. Regardless of the heat dissipation method, the final heat dissipation medium is air , others are intermediate links, air natural convection cooling is the most direct and convenient way, heat pipes rapidly expand the application range of self-cooling, because the heat pipe self-cooling system does not need fans, no noise, maintenance-free, safe and reliable, heat pipe air-cooled Even self-cooling can replace the water-cooling system, saving water resources and related auxiliary ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05D23/19F25B21/02
CPCF25B21/02G05D23/1917Y02B30/70
Inventor 刘峰铭
Owner SHENZHEN JIANJU SCI & TECH LTD
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