SMT electronic component Tthree-dimensional reconstruction method for SMT electronic component based on deep learning

An electronic component and deep learning technology, applied in 3D modeling, electrical digital data processing, image data processing, etc., can solve the problems of 3D reconstruction data thorns, uneven brightness, collapse, etc., to reduce instability and surface distortion little effect

Active Publication Date: 2020-09-11
嘉兴市像景智能装备有限公司
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Problems solved by technology

[0004] The present invention aims at the technical problem that the three-dimensional reconstruction of the electronic components on the PCB in the existing SMT is uneven in brightness caused by the light source, the color and material of the substrate, and the surface characteristics of the components themselves, which leads to the technical problems of thorns and collapses in the three-dime...

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  • SMT electronic component Tthree-dimensional reconstruction method for SMT electronic component based on deep learning
  • SMT electronic component Tthree-dimensional reconstruction method for SMT electronic component based on deep learning
  • SMT electronic component Tthree-dimensional reconstruction method for SMT electronic component based on deep learning

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[0027] In order to make those skilled in the art better understand the technical scheme of the present invention, the present invention is described in detail below, and the description of this part is only exemplary and explanatory, and should not have any limiting effect to the protection scope of the present invention.

[0028] The steps of the technical solution adopted in the present invention are as follows:

[0029] Step 1: Project the sinusoidal fringe light to the object to be measured by the traditional method, obtain the relative phase and restore the absolute phase by the phase shift method, and convert the absolute phase into height data by giving the calibration data, so as to obtain the 3D model of the object to be detected.

[0030] Specifically, the three-dimensional data of the measured object is obtained in the following manner, actively project a set of phase shift patterns onto the surface of the measured object, and synchronously collect the images after t...

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Abstract

The invention provides a three-dimensional data reconstruction method based on deep learning after three-dimensional optical measurement of an SMT surface mounted electronic component three-dimensional optical measurement. The three-dimensional data reconstruction method comprises the following steps of step that 1, restoring the surface of a measured object is restored through a phase displacement method; step 2, constructing a neural network, and obtaining a multi-angle 2D image of the detected object through multi-angle shooting to restore a 3D model of the detected object; step 3, synthesizing the final most perfect three-dimensional contour by using the two types of 3D model data obtained in the step 1 and the step 2; and step 4, performing cross-parallel ratio calculation on the model data pushed by the traditional method and the neural network, and when the score is relatively low, updating and training the neural network in the step 2 by using the data in the step 1.

Description

technical field [0001] The invention relates to the field of optical detection of SMT surface mounting, in particular to a method for three-dimensional reconstruction of SMT electronic components based on deep learning. Background technique [0002] SMT, or surface mount technology, is the abbreviation of a series of process processes processed on the basis of PCB. It is the most popular technology and process in the electronic assembly industry. Almost every electronic device we commonly see in life, such as mobile phones, automobiles, etc. Computers, home appliances, electronic communications, etc. will use the circuit system produced by the SMT process. These systems are designed by electronic components such as PCBs, capacitors, resistors, and chips according to the designed circuit diagram. The SMT process has been following the electronics since its birth. The development of technology continues to increase the difficulty of the process. The SMT process requires high r...

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Application Information

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IPC IPC(8): G06F30/367G06T17/00G06N3/04
CPCG06F30/367G06T17/00G06N3/044G06N3/045Y02P90/30
Inventor 翟雷董杰楚杨阳刘草佘敏敏葛霖
Owner 嘉兴市像景智能装备有限公司
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