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Heat dissipation equipment for electronic component

A technology of heat dissipation equipment and electronic components, which is applied in the direction of electrical components, electrical equipment structural parts, and modification through conduction heat transfer, etc., which can solve the problems of low heat dissipation efficiency of heat dissipation equipment, increase wind pressure, reduce noise, reduce The effect of the turbulent zone

Pending Publication Date: 2020-09-11
燕凤侠
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a heat dissipation device for electronic components, which solves the problem of low heat dissipation efficiency of the heat dissipation device for electronic components

Method used

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  • Heat dissipation equipment for electronic component
  • Heat dissipation equipment for electronic component
  • Heat dissipation equipment for electronic component

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] An embodiment of the present invention provides a cooling device for electronic components, such as Figure 1-4 As shown, the radiator frame 1 is included, and the interior of the radiator frame 1 is provided with a refrigerator 2 and an electrical component 3. The refrigerator 2 is located on the lower side of the electrical component 3, and the refrigerator 2 is arranged on the lower side of the electrical component 3, which can be contacted through th...

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Abstract

The invention provides heat dissipation equipment for an electronic element, and relates to the technical field of heat dissipation equipment. The heat dissipation equipment for the electronic component comprises a heat dissipation frame, a refrigerator and an electrical component are arranged in the heat dissipation frame, the refrigerator is located on the lower side of the electrical component,ventilation holes are formed in the two corresponding sides of the heat dissipation frame, a heat conduction plate is fixedly connected to the two corresponding sides of the heat dissipation frame, and an air guide assembly used for controlling the temperature is arranged on the heat conduction plate. When the temperature of the electric appliance element in the heat dissipation frame is too high, hot wind convection is formed in the heat dissipation frame, when a certain temperature is reached, and an electric conduction piece is twisted outwards to make contact with a second electric contact piece to be powered on, so that the refrigerator and a volute fan are powered on to be started, the temperature of the electric component is rapidly reduced, when the temperature is reduced to the normal level, a torque spring returns to enable a circuit to be disconnected, electric energy is saved, and heat dissipation of the electronic component is efficiently achieved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation equipment, in particular to a heat dissipation equipment for electronic components. Background technique [0002] Electronic components are the basis of electronic products. Understanding the types, structures, and performance of commonly used electronic components and being able to choose them correctly are the basis for learning and mastering electronic technology. Commonly used electronic components include: resistors, capacitors, inductors, potentiometers, transformers, etc. In terms of installation methods, they can be divided into two categories: traditional installation and surface installation. [0003] However, the temperature of electronic components rises rapidly during operation, and they are often damaged due to excessive temperature, which makes the heat dissipation problem particularly important. The existing heat dissipation is mainly based on small fans, and the small fan...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20H05K7/20136H05K7/2039
Inventor 燕凤侠
Owner 燕凤侠
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