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Method used to manufacture hairspring

A hairspring, silicon-made technology used in the manufacture of springs including helical elastic sheets, which can solve problems such as damage to productivity

Active Publication Date: 2022-05-13
CSEM CENT SUISSE DELECTRONIQUE & DE MICROTECHNIQUE SA RECH & DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This degree of deformation can be reduced by changing one or the other of the latter two parameters, at the expense of productivity

Method used

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  • Method used to manufacture hairspring
  • Method used to manufacture hairspring
  • Method used to manufacture hairspring

Examples

Experimental program
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Embodiment Construction

[0012] Such as figure 1 As shown, the first step of the method according to the preferred embodiment of the present invention is to provide a substrate 1 made of silicon, which extends in a plane P and carries on its upper surface parallel to the plane P a silicon oxide ( SiO 2 ) constitutes the first layer 2. Depending on whether the balance spring or springs to be produced are formed in the base plate 1 or in another layer, the thickness (height) of the base plate 1 may correspond to the thickness of the balance spring or springs to be produced, i.e. Typically 120 μm, or less than the thickness of the balance spring or springs to be manufactured. In the second case, however, the substrate 1 is sufficiently thick, typically several tens of micrometers, to prevent deformation of the substrate 1 . The thickness of the first layer 2 is, for example, 3 μm. Regardless of the crystal orientation of the silicon of the substrate 1, the silicon of the substrate 1 may be monocryst...

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Abstract

The method according to the invention for manufacturing at least one balance spring (5) comprises the following successive steps: a) providing a substrate (1) extending in a plane (P) and carrying a first layer (2) parallel to the plane (P) ); b) forming at least one via (3) in the first layer (2); c) depositing a second layer (4) on the first layer (2), the second layer (4) filling the at least one via holes (3) to form at least one bridge of material (7); d) etching at least one hairspring (5) in the etching layer (6a) consisting of the second layer (4) or substrate (1), the second layer (4 ) and one of the unetched at least one balance spring (5) in the substrate (1) constitutes a support (6b), the at least one material bridge (7) connects the at least one balance spring (5) perpendicularly to the plane (P) to the support (6b); e) eliminating the first layer (2), the at least one balance spring (5) remains attached to the support (6b) by the at least one material bridge (7); f) making the at least one balance spring (5) subjecting to at least one heat treatment; g) detaching the at least one balance spring (5) from the support (6b).

Description

technical field [0001] The invention relates to a method for manufacturing a balance spring, ie a method for manufacturing a spring comprising a helical elastic foil. In common application, a balance spring is intended to be fitted to a balance wheel so as to form with it the resonator of a timepiece movement. Such a timepiece balance spring is usually fastened at its inner end to the balance shaft by a collet and at its outer end by screws or other fastening means to a movement bridge called a "coq". Background technique [0002] The Applicant's patent application EP 3181938 describes a method for manufacturing a hairspring of predetermined stiffness, according to which a) a hairspring of dimensions larger than that required to obtain a hairspring of predetermined stiffness is formed, b) the thus formed stiffness of the balance spring, c) calculation of the thickness of material to be removed in order to obtain a balance spring of predetermined stiffness, and d) removal of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G04D3/00G04B17/06
CPCG04B17/066G04D3/0041C30B29/06C30B33/12G03F7/20
Inventor 米歇尔·德斯庞特弗雷德里克·科勒奥利维尔·汉兹克尔让-露丝·柏凯丽
Owner CSEM CENT SUISSE DELECTRONIQUE & DE MICROTECHNIQUE SA RECH & DEV