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A digital holographic surface three-dimensional topography measurement system and imager

A technology of digital holography and three-dimensional morphology, applied in the field of three-dimensional imaging, can solve the problems that the three-dimensional imaging system cannot meet the needs of scientific research

Active Publication Date: 2022-05-13
北京钛极科技有限公司
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Problems solved by technology

[0003] However, the current 3D imaging system can no longer meet the needs of scientific research

Method used

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  • A digital holographic surface three-dimensional topography measurement system and imager
  • A digital holographic surface three-dimensional topography measurement system and imager
  • A digital holographic surface three-dimensional topography measurement system and imager

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Embodiment Construction

[0054] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0055] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0056] refer to figure 1 , figure 1 It is a schematic structural diagram of a digital holographic surface three-dimensional topography measurement system provided by an embodiment of the present invention.

[00...

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Abstract

The invention provides a digital holographic surface three-dimensional topography measurement system and an imager. The objective lens module interface provided in the system can realize micron-level precision surface three-dimensional structure imaging under a centimeter-level field of view when no objective lens module is assembled. When corresponding to other actual imaging requirements such as partial cell imaging and MEMS system imaging, different objective lens modules are assembled on the objective lens module interface to meet different lateral resolution requirements and field of view requirements. Moreover, the self-aggregation module set in the digital holographic surface 3D topography measurement system can adjust the focal length and the size of the imaging field of view in real time to change the plane resolution and meet the measurement requirements of more application scenarios. Moreover, the digital holographic surface 3D The shape measurement system includes single-wavelength digital holographic micro-imaging mode, dual-wavelength digital holographic micro-imaging mode and multi-wavelength digital holographic micro-imaging mode. By switching different light source modules, the axial resolution can be changed.

Description

technical field [0001] The invention relates to the technical field of three-dimensional imaging, and more specifically, relates to a digital holographic surface three-dimensional shape measurement system and an imager. Background technique [0002] With the continuous development of science and technology, various imaging systems have been widely used in people's work, which provides great convenience for the development of scientific research. [0003] However, the current 3D imaging system can no longer meet the needs of scientific research. Contents of the invention [0004] In view of this, in order to solve the above problems, the present invention provides a digital holographic surface three-dimensional shape measurement system and imager, the technical solution is as follows: [0005] A digital holographic surface three-dimensional shape measurement system, said digital holographic surface three-dimensional shape measurement system comprising: [0006] The first ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/24
CPCG01B11/2441
Inventor 王喆邹如飞
Owner 北京钛极科技有限公司
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