Diamond Grinding Wheel with Orderly Arrangement of Crystal Oriented Abrasives

Abstract

The invention discloses a diamond grinding wheel with crystal oriented abrasives arranged in order, which is characterized in that the grinding wheel comprises a matrix and an abrasive layer, and the abrasive layer is composed of a large number of honeycomb-shaped micro-grinding units and a large number of intersecting micro-channels; the micro-grinding The cutting unit is composed of amorphous carbon, diamond bonding layer and diamond abrasive grains oriented by multiple crystals; amorphous carbon enables the orientation of abrasive grain crystals, and the top surface of each abrasive grain is a smooth {100} crystal plane, and the sides are uniform It is a high-hardness {111} crystal surface, which enhances the cutting performance and wear resistance of the abrasive grains; the diamond bonding layer connects multiple abrasive grains into one body, which can prevent single abrasive grains from falling off, and the edge height of the abrasive grains can be increased 60%~70% of the height of the micro-grinding unit prolongs the service life of the grinding wheel; a large number of honeycomb-shaped micro-grinding units are arranged in a staggered order, and the gaps form a large number of cross-shaped micro-channels. The structure of the grinding wheel improves the The effective flow rate and chip removal capacity of grinding fluid significantly enhance the grinding performance of the grinding wheel.

Description

technical field [0001] The invention relates to a diamond grinding wheel, in particular to a diamond grinding wheel in which crystalline directional abrasives are arranged in an orderly manner. [0002] technical background [0003] Grinding, as an important method in advanced manufacturing technology, is widely used in aerospace, national defense, mechanical electronics and other fields. Especially in the ultra-precision grinding of hard and brittle materials such as ceramics, glass, and optical crystals, in order to achieve nanometer-level surface roughness, sub-micron-level surface accuracy and micron-level subsurface damage, the adopted Diamond grinding wheels are extremely demanding. The traditional diamond grinding wheel uses resin, ceramics or metal as the binder, and the diamond abrasive is fully mixed with the binder before sintering. However, shrinkage and deformation will inevitably occur during the sintering process, and each abrasive grain of the diamond grindin...

AI Technical Summary

Problems solved by technology

However, this technical solution still has the following problems: since the diamond abrasive grains are randomly pressed into the blind hole, the edge angle and top surface shape of each abrasive grain are random, and the crystal orientation of the diamond abrasive grains cannot be realized, thereby affecting the grinding wheel. The improvement of the grinding performance is limited, and further improvement is urgently needed; at the same time, the depth of the abrasive grains pressed into the blind hole is also inconsistent, resulting in a large difference in the edge height of the abrasive grains, which greatly reduces the number of effective grinding edges of the grinding wheel during grinding , reducing the grinding efficiency

However, the technical solution still has the following problems: the invention is mainly applied to diamond brazing products, and the diamond grinding layer made by brazing has a low edge height and a small chip space, which makes the chip removal cooling ability of the grinding wheel poor; on the other hand, There are a large number of micro-defects etched by pulsed laser on the working surface of diamond abrasive grains. Although the number of effective grinding edges of the grinding wheel is increased, these micro-defects also have a certain degree of influence on the strength and crystal shape of diamond abrasive grains. Destruction, shortening the service life of the diamond grinding wheel

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