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Cable and combined cable

A cable and wire technology, applied in the field of combined cables, can solve the problems of easy dislocation of the ground wire, low high-frequency test bandwidth, poor stability, etc.

Pending Publication Date: 2020-10-27
TYCO ELECTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the high-frequency test bandwidth that this structure can achieve is low, and in the process of bending, the stability is not good, and the ground wire 5' is also easy to be misplaced

Method used

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  • Cable and combined cable
  • Cable and combined cable
  • Cable and combined cable

Examples

Experimental program
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Embodiment Construction

[0033] Although the present disclosure will be fully described with reference to the accompanying drawings containing preferred embodiments of the present disclosure, it should be understood before proceeding that those skilled in the art can modify the disclosure described herein while obtaining the technical effects of the present disclosure. Therefore, it should be understood that the above description is a broad disclosure for those of ordinary skill in the art, and its content is not intended to limit the exemplary embodiments described in the present disclosure.

[0034] In addition, in the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a comprehensive understanding of the embodiments of the present disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in diagrammatic form...

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Abstract

The invention discloses a cable and a combined cable comprising the same. The cable of the combined cable comprising: two conductive wires, wherein each conductive wire comprises a conductor and a conductive wire insulating layer wrapping the conductor; an internal insulating layer wrapping the outer portions of the conductive wire insulating layers of the two conductive wires so as to fix the twoconductive wires; a metal shielding layer wrapping the outer surface of the internal insulating layer, wherein the metal shielding layer comprises an insulating substrate and a metal conductive layerbonded on the insulating substrate; and an external insulating layer wrapping the outer surface of the metal shielding layer, wherein the metal conducting layer of the metal shielding layer faces theexternal insulating layer. According to the cable, the internal insulating layer is longitudinally wrapped between the metal shielding layer and the two conductive wires to fix the two conductive wires and prevent the longitudinal metal shielding layer from entering the gap between the two conductive wires, and the metal conductive layer of the metal shielding layer faces the outer side to be used for grounding, so that a ground wire is omitted; and with the cable, the high-frequency test bandwidth can reach more than 40G, and the performance is more stable.

Description

technical field [0001] Embodiments of the present disclosure relate to a cable, and a combination cable including the same. Background technique [0002] The cable structure 10' of the current high-speed cable is as figure 1 As shown, it includes two wires 1' and a ground wire 5', and a metal shielding layer 3' is longitudinally wrapped outside the two wires 1' and a ground wire 5', and then the metal shielding layer 3' is wrapped with an insulating layer 4' to fix the metal shielding layer 3'. However, the high-frequency test bandwidth that this structure can achieve is low, and in the process of bending, the stability is not good, and the ground wire 5' is also easy to be misplaced. Contents of the invention [0003] An object of the present disclosure is to solve at least one aspect of the above-mentioned problems and disadvantages in the prior art. [0004] According to an embodiment of an aspect of the present disclosure, a cable is provided, including [0005] tw...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B7/17H01B7/08H01B7/02H01B11/10
CPCH01B7/17H01B7/0861H01B7/0216H01B11/1091H01B3/427H01B11/1008H01B7/0807H01B7/0869
Inventor 陆海南姚伟凯文·E·魏德
Owner TYCO ELECTRONICS (SHANGHAI) CO LTD
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