Heat-dissipating bracket forming die for main board of industrial camera

Abstract

The invention relates to a heat-dissipating bracket forming die for a main board of an industrial camera. The die comprises an upper die seat, a lower die seat, an upper die, an upper die stripping assembly, a lower die and a lower die stripping assembly, wherein the upper die stripping assembly comprises an upper stripping fixing plate, an upper stripping moving plate, a plurality of connecting columns, a plurality of upper striping ejector pins and a plurality of springs. The upper stripping fixing plate is arranged on the side, far away from the lower die, of the upper die and is connectedto the upper die seat; the upper stripping moving plate is movably located between the upper stripping fixing plate and the upper die, and the springs are located between the upper stripping moving plate and the upper stripping fixing plate; the first ends of the connecting columns are connected to the part, close to the edge, of the upper stripping moving plate, and the second ends of the connecting columns lean against the part, close to the edge, of the upper die; the first ends of the upper stripping ejector pins are fixedly connected to the upper striping moving plate, a plurality of upper ejector pin holes are formed in the upper die, and the second ends of the upper stripping ejector pins penetrate the upper ejector pin holes of the upper die. Therefore, stripping of a product and an upper die bracket can be achieved automatically, and deformation and damage of a convex rib of the product can be avoided.

Description

technical field [0001] The invention relates to the technical field of industrial camera production, in particular to a mold for forming a cooling bracket for an industrial camera motherboard. Background technique [0002] Please refer to Figure 7 The back side of the industrial camera motherboard cooling bracket 100 is protrudingly provided with several convex ribs 110, the side surfaces at both ends along the length direction are recessed to be provided with handle grooves 101 and a plurality of first through holes 102, and the sides along the length direction are provided with second holes. through hole 103 . Existing molds are only provided with some thimbles in the lower mold, and the thimbles hold up the newly formed industrial camera main board heat dissipation bracket 100 when demolding, but due to the existence of several convex ribs 110, the industrial camera main board heat dissipation support 100 is Adhesive force is generated between the ribs 110 and the upper...

AI Technical Summary

Problems solved by technology

Existing molds are only provided with some thimbles in the lower mold, and the thimbles hold up the newly formed industrial camera main board heat dissipation bracket 100 when demolding, but due to the existence of several convex ribs 110, the industrial camera main board heat dissipation support 100 is Adhesion occurs between ribs 110 and the upper mold, making it difficult to demould smoothly, or the ribs 110 are deformed and damaged during demoulding

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