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Semi-automatic chip detection equipment for chip processing and production

A detection equipment, semi-automatic technology, applied in semiconductor/solid-state device testing/measurement, semiconductor/solid-state device manufacturing, conveyor objects, etc., can solve problems such as slow efficiency

Inactive Publication Date: 2020-11-06
肖小勇
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this stage, in the process of chip production and processing, it is necessary to test and analyze the finished chip, but the current tester must manually place the chip to be tested under the tester for testing, and the efficiency is slow

Method used

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  • Semi-automatic chip detection equipment for chip processing and production
  • Semi-automatic chip detection equipment for chip processing and production
  • Semi-automatic chip detection equipment for chip processing and production

Examples

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0021] Unless otherwise defined separately, directions such as up, down, left, right, front, back, inside and outside referred to herein are up, down, left, right, front and back in the drawings shown in the present invention. , inside and outside directions shall prevail, which shall be explained together here.

[0022] The present invention provides such Figure 1-4 A chip semi-automatic detection device for chip processing and production shown, including a...

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PUM

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Abstract

The invention discloses semi-automatic chip detection equipment for chip processing and production. The equipment comprises conveying wheels, detection mechanisms, pushing mechanisms and a counterweight plate, the peripheries of the two sets of conveying wheels arranged side by side are in transmission connection with a belt. Rotating shafts are welded to the two sides of the conveying wheels. Theconveying wheels are hinged with a U-shaped supporting plate through the rotating shafts; one group of rotating shafts penetrates through the vertical part of the supporting plate; and the rotating shafts are connected with an output shaft of a rotating motor through a coupler; and the rotating motor is connected to the side face of the vertical part of the supporting plate through screws. The counterweight plate is arranged below the supporting plate, the supporting plate is connected with the counterweight plate through a plurality of sets of countersunk bolts, two sets of limiting mechanisms, the set of detection mechanisms and the set of pushing mechanisms are arranged at the top end of the counterweight plate, and the detection mechanisms are arranged between the limiting mechanismsand the pushing mechanisms. The semi-automatic chip detection equipment for chip processing and production not only can realize automatic transmission, but also can automatically stop and carry out detection, and is time-saving and labor-saving.

Description

technical field [0001] The invention belongs to the technical field of chip detection, and in particular relates to a chip semi-automatic detection device for chip processing and production. Background technique [0002] Chips (collectively referred to as semiconductor component products), also known as integrated circuits, microcircuits, microchips, and wafers, are a way of miniaturizing circuits (mainly including semiconductor devices, but also passive components, etc.) On the surface of a semiconductor wafer, an integrated circuit that manufactures a circuit on the surface of a semiconductor chip is also called a thin-film integrated circuit. Another thick-film integrated circuit is composed of independent semiconductor devices and passive components integrated into a substrate or circuit board. Miniaturized circuits. At this stage, in the process of chip production and processing, it is necessary to test and analyze the finished chip, but the current tester must manuall...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66H01L21/67H01L21/677
CPCH01L21/67259H01L21/67742H01L22/00
Inventor 肖小勇
Owner 肖小勇
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