Automatic laminating machine for thin-film circuit board and protective film

Abstract

The invention relates to an automatic laminating machine for a thin film circuit board and a protective film, which is structurally characterized in that a protective film coil stock feeding mechanism, an automatic stripping mechanism, a protective film position shooting camera set and a correction platform are sequentially arranged, a protective film taking mechanism is arranged on the side surfaces of the automatic stripping mechanism and the correction platform, and a thin film circuit board MARK point shooting camera set is arranged below the correction platform. The device has the advantages that the structural design is simple and reasonable, the protective film coil stock feeding mechanism is adopted and automatically peeled (peeled into single protective films), the protective films are automatically supplied (release paper waste is automatically collected through the release paper waste collecting shaft), materials are automatically taken, and the camera is used for automatically taking pictures (the positions of MARK points and the protective films of the thin-film circuit board are found respectively); the positions of the thin film circuit board and the protective filmcan be automatically corrected, the thin film circuit board and the protective film are automatically attached and assembled, manual assembly is not needed, time and labor are saved, the production cost is saved, and the production efficiency and the assembly precision are improved.

Description

technical field [0001] The invention relates to an automatic bonding machine for film circuit boards and protective films. Background technique [0002] Thin film circuit board is a flexible circuit board made of PET film as the base material and has flexibility. It is widely used in keyboard production. In the production of the keyboard, it is necessary to bond the thin film circuit board and the protective film. [0003] In the prior art, the bonding of the film circuit board and the protective film is all done manually, that is, the protective film is peeled off manually, and then bonded to the film circuit board, which has defects such as low efficiency, low precision, and easy generation of air bubbles. Contents of the invention [0004] The present invention proposes an automatic laminating machine for thin film circuit boards and protective films. Accurate and prevent air bubbles. [0005] Technical solution of the present invention: thin film circuit board and ...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the bonding of the thin film circuit board and the protective film is all done manually, that is, the protective film is peeled off manually, and then bonded to the thin film circuit board, which has defects such as low efficiency, low precision, and easy generation of air bubbles.

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