Automatic eutectic machine and eutectic method
An automatic, crystal-bonding technology, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve problems affecting the quality of chip bonding, short nitrogen protection time, and poor eutectic effect, so as to improve the eutectic effect and ensure the eutectic effect. crystal quality, anti-oxidation effect
Active Publication Date: 2021-05-04
SHENZHEN XINYICHANG TECH CO LTD
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Problems solved by technology
[0004] The purpose of the embodiment of the present application is to provide an automatic eutectic machine and eutectic method to solve the problem of eutectic welding in the related art, due to the elastic vibration when the chip is fixed on the bracket, and the vibration when the crystal feeding head moves , the factors of uneven heating of the eutectic table will lead to poor eutectic effect, short nitrogen protection time, easy oxidation of solder joints after eutectic, and affect the quality of chip bonding
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[0055] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.
[0056] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element. In the description of the present application, "plurality" means two or more, unless otherwise specifically defined. "Several" means one or more than one, unless otherwise clearly and s...
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Abstract
The application provides an automatic eutectic machine and a eutectic method. The automatic eutectic machine includes a frame; a wafer table; a feeding mechanism; a discharging mechanism; The heating block in the trough, the cover plate covering the chute and the nitrogen gas pipe used to fill the chute with nitrogen, there is a slideway between the cover plate and the heating block, and the cover plate is provided with an opening for solid crystal; The mechanism is used to press the support belt exposed at the opening of the crystal bonding against the heating block; and the crystal feeding mechanism. By laying a heating block in the slideway, the temperature curve of the heating bracket can be controlled to improve the eutectic effect; nitrogen can be filled in the slideway to provide anti-oxidation protection before and after the eutectic; the support belt can be pressed against the holding mechanism to reduce the eutectic effect. The small bracket has elastic deformation; the setting of the hedging table can reduce the vibration when the die-bonding head moves, so that the chip can be accurately placed on the die-bonding position, so as to ensure that the chip is accurately and stably installed in the corresponding die-bonding position to ensure the quality of the eutectic .
Description
technical field [0001] This application belongs to the technical field of crystal bonding, and more specifically relates to an automatic eutectic machine and a eutectic method. Background technique [0002] Eutectic refers to the phenomenon of eutectic fusion in eutectic solder at a relatively low temperature. The eutectic alloy directly changes from solid to liquid without going through the plastic stage. It is an equilibrium reaction in which one liquid generates two solids at the same time. Its melting temperature is called eutectic temperature. Eutectic soldering technology is widely used in the electronic packaging industry, such as the bonding of chips and substrates, the bonding of substrates and shells, and the capping of shells, etc. Compared with traditional epoxy conductive adhesive bonding, eutectic welding has the advantages of high thermal conductivity, low resistance, fast heat transfer, strong reliability, and large shear force after bonding, and is suitable...
Claims
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IPC IPC(8): H01L21/67H01L21/60
CPCH01L21/67144H01L24/75H01L24/83H01L2224/751H01L2224/758H01L2224/83075H01L2224/83805
Inventor 胡新荣
Owner SHENZHEN XINYICHANG TECH CO LTD