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A kind of manufacturing method of aluminum-based copper-clad laminate

A technology of aluminum-based copper clad laminate and manufacturing method, applied in chemical instruments and methods, lamination auxiliary operations, lamination and other directions, can solve the problems of inability to scrape, increase material waste, increase the consumption of manpower and material resources, etc., to reduce cleaning steps, improve smoothness, reduce consumption effect

Active Publication Date: 2021-05-11
福建鑫宏华机械有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention can solve the problem that the existing equipment cannot scrape off the excess glue after the copper foil is laminated when manufacturing aluminum-based copper-clad laminates, resulting in glue residue on the surface of aluminum-based copper-clad laminates after forming, increasing the The step of cleaning the surface of aluminum-based copper-clad laminates increases the consumption of manpower and material resources. At the same time, the function of tensioning the copper foil cannot be realized, and the copper foil cannot be kept flat when pasted. Wrinkles are easy to appear after the copper foil is pasted. Thereby reducing the smoothness of the surface of the aluminum-based copper clad laminate, increasing the waste of materials and other problems

Method used

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  • A kind of manufacturing method of aluminum-based copper-clad laminate
  • A kind of manufacturing method of aluminum-based copper-clad laminate
  • A kind of manufacturing method of aluminum-based copper-clad laminate

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Embodiment Construction

[0033] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways defined and covered by the claims.

[0034] Such as Figure 1 to Figure 8 As shown, in order to achieve the above object, the present invention adopts the following technical solution, a method for manufacturing an aluminum-based copper-clad laminate, which uses an aluminum-based copper-clad laminate manufacturing equipment, the aluminum-based copper-clad laminate manufacturing equipment includes a base plate 1, a receiving device 2 and pressing device 3, the specific method when using the above-mentioned aluminum-based copper-clad laminate manufacturing equipment to manufacture aluminum-based copper-clad laminates is as follows:

[0035] S1. Equipment inspection: Before the equipment is used, the equipment is routinely inspected manually;

[0036] S2. Material installation: manually fi...

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Abstract

The invention relates to a method for manufacturing an aluminum-based copper-clad laminate, comprising a bottom plate, a holding device and a pressing device. A holding device is installed on the top of the bottom plate through a support column, a pressing device is arranged above the holding device, and the pressing device is installed on the bottom plate. superior. The invention can solve the problem that the existing equipment cannot scrape off the excess glue after the copper foil is laminated when manufacturing aluminum-based copper-clad laminates, resulting in glue residue on the surface of aluminum-based copper-clad laminates after forming, increasing the The step of cleaning the surface of aluminum-based copper-clad laminates increases the consumption of manpower and material resources. At the same time, the function of tensioning the copper foil cannot be realized, and the copper foil cannot be kept flat when pasted. Wrinkles are easy to appear after the copper foil is pasted. Thereby, the smoothness of the surface of the aluminum-based copper clad laminate is reduced, and problems such as waste of materials are increased.

Description

technical field [0001] The invention relates to the technical field of manufacturing copper-clad laminates, in particular to a method for manufacturing aluminum-based copper-clad laminates. Background technique [0002] Aluminum-based copper-clad laminate is a kind of raw material, which is made of electronic glass fiber cloth or other reinforcing materials impregnated with resin, single resin, etc. Plate-shaped material; aluminum-based copper-clad laminate is used as the substrate material in the manufacture of printed circuit boards, which mainly plays the role of interconnection, conduction, insulation and support for printed circuit boards, and affects the transmission speed, energy loss and characteristic impedance of signals in the circuit. etc. have a great influence; the aluminum-based copper-clad laminate manufacturing industry is a sunrise industry, it has broad development prospects along with the development of electronic information and communication copper-clad...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/10B32B37/12B32B38/16B32B37/00
CPCB32B37/0007B32B37/10B32B37/12B32B38/162
Inventor 潘锡丹
Owner 福建鑫宏华机械有限公司
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