A kind of manufacturing method of aluminum-based copper-clad laminate

Abstract

The invention relates to a method for manufacturing an aluminum-based copper-clad laminate, comprising a bottom plate, a holding device and a pressing device. A holding device is installed on the top of the bottom plate through a support column, a pressing device is arranged above the holding device, and the pressing device is installed on the bottom plate. superior. The invention can solve the problem that the existing equipment cannot scrape off the excess glue after the copper foil is laminated when manufacturing aluminum-based copper-clad laminates, resulting in glue residue on the surface of aluminum-based copper-clad laminates after forming, increasing the The step of cleaning the surface of aluminum-based copper-clad laminates increases the consumption of manpower and material resources. At the same time, the function of tensioning the copper foil cannot be realized, and the copper foil cannot be kept flat when pasted. Wrinkles are easy to appear after the copper foil is pasted. Thereby, the smoothness of the surface of the aluminum-based copper clad laminate is reduced, and problems such as waste of materials are increased.

Description

technical field [0001] The invention relates to the technical field of manufacturing copper-clad laminates, in particular to a method for manufacturing aluminum-based copper-clad laminates. Background technique [0002] Aluminum-based copper-clad laminate is a kind of raw material, which is made of electronic glass fiber cloth or other reinforcing materials impregnated with resin, single resin, etc. Plate-shaped material; aluminum-based copper-clad laminate is used as the substrate material in the manufacture of printed circuit boards, which mainly plays the role of interconnection, conduction, insulation and support for printed circuit boards, and affects the transmission speed, energy loss and characteristic impedance of signals in the circuit. etc. have a great influence; the aluminum-based copper-clad laminate manufacturing industry is a sunrise industry, it has broad development prospects along with the development of electronic information and communication copper-clad...

AI Technical Summary

Problems solved by technology

[0005] The invention can solve the problem that the existing equipment cannot scrape off the excess glue after the copper foil is laminated when manufacturing aluminum-based copper-clad laminates, resulting in glue residue on the surface of aluminum-based copper-clad laminates after forming, increasing the The step of cleaning the surface of aluminum-based copper-clad laminates increases the consumption of manpower and material resources. At the same time, the function of tensioning the copper foil cannot be realized, and the copper foil cannot be kept flat when pasted. Wrinkles are easy to appear after the copper foil is pasted. Thereby reducing the smoothness of the surface of the aluminum-based copper clad laminate, increasing the waste of materials and other problems

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