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Method for progressive pre-separation of flexible display and add-on circuit board

A flexible display and additional circuit technology, applied in instruments, metal processing equipment, identification devices, etc., can solve problems such as curling, deformation, damage, and inability to conform to industry 4.0 industry trends

Active Publication Date: 2022-08-02
USUN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, see Figure 9 Shown, be the test chart of film layer peeling strength in the prior art, the horizontal axis in the figure is to take off the distance (unit: millimeter), and the vertical axis is to take off the power (unit: kilogram weight), can be seen from the figure It is clearly seen that the release force difference between the irradiated pre-release area and the non-pre-release area is too large (at the position of 100mm in the figure), so that the film layer will undergo curling deformation or deformation during the peeling process. The condition of damage will affect the flatness and pass rate of the film layer, so that the film layer cannot be vacuum-adsorbed, so that the film layer cannot be followed by a continuous automated process, which seriously affects the working hours and production capacity, so that it cannot meet the requirements of the industry. 4.0 Industry Trends

Method used

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  • Method for progressive pre-separation of flexible display and add-on circuit board
  • Method for progressive pre-separation of flexible display and add-on circuit board
  • Method for progressive pre-separation of flexible display and add-on circuit board

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Embodiment Construction

[0030] In order to achieve the above objects and effects, the technical means and structures adopted by the present invention are described in detail with reference to the preferred embodiments of the present invention and their features and functions are as follows.

[0031] see figure 1 , figure 2 , image 3 , Figure 4 , Figure 5 , Image 6 , Figure 7 , Figure 8 As shown in the figure, it can be clearly seen from the figure that the additional circuit board 1 is made of a light-transmitting material through which laser light can pass, and a flexible display 2 is combined on the surface of the additional circuit board 1, and the flexible display 2. There is a film 21 combined with the additional circuit board 1, and a release layer 211 is combined between the film 21 and the additional circuit board 1, and at least one electronic component is arranged on the other side surface of the film 21 relative to the additional circuit board 1 22, and the ineffective area ...

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Abstract

The invention discloses a method for progressive pre-separation of a flexible display and an additional circuit board. The additional circuit board is firstly placed on a bearing mechanism of a laser equipment, and the additional circuit board is directed to the light-emitting side of the laser device of the laser equipment. The laser device irradiates laser light from the starting position of peeling off the film to the turning position on the film, so that the irradiated film is separated from the additional circuit board, and the laser device continues from the turning position to the end position of peeling off the film. The laser light is irradiated at the place to make the release force of the film gradually increase from the turning position to the end position of the peeling. This laser method can make the film's irradiated pre-release area and non-pre-release area at the junction of the release force. There is no sudden rise phenomenon, so as to avoid the large change of the release force at the junction, so as to prevent the film from being deformed or damaged, so as to maintain the good flatness of the film and improve the pass rate, so as to meet the needs of the automated process.

Description

technical field [0001] The invention provides a method for progressive pre-separation of a flexible display and an additional circuit board, in particular, a laser device is used to separate a film from a peeling start position to a turning position from the additional circuit board, and then the film is separated from the turning position to the peeling end position. The release force gradually increases, so that the release force between the pre-release area and the non-pre-release area does not rise sharply, so as to prevent the film from being deformed or damaged. Background technique [0002] With the advent of the Internet of Things (IoT) and Industry 4.0 (Industry 4.0) era, the number and applications of connected devices have increased significantly, and most of these connected devices communicate and interact with each other without Automatically with human intervention, so there will be more and more devices that need to automatically cooperate with each other with...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/00B23K26/50G09F9/30
CPCB23K26/50B23K26/00G09F9/301
Inventor 李隆翔潘雷
Owner USUN TECH CO LTD