Hot repair method and device for software development kit and electronic equipment

A software development tool and hot repair technology, applied in the field of information processing, can solve problems such as the inability to realize the function of the desugaring tool, affecting the data processing speed, and increasing the SDK hot repair code.

Active Publication Date: 2021-02-26
BEIJING BYTEDANCE NETWORK TECH CO LTD
View PDF7 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When hotfixing the SDK code of an expression containing syntactic sugar, it is generally implemented by desugaring during the SDK compilation process. However, this implementation will cause the APK to be desugared after the SDK is connected to the application. The function of the tool cannot be realized. Moreover, for SDK hotfix codes with many expressions containing grammatical sugar, the number of methods of SDK hotfix codes will be increased, so that the data volume of SDK hotfix codes will affect the data processing speed; in addition, for When there are custom plug-ins in the SDK compilation process, all sugar removal cannot be achieved successfully

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Hot repair method and device for software development kit and electronic equipment
  • Hot repair method and device for software development kit and electronic equipment
  • Hot repair method and device for software development kit and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present disclosure are shown in the drawings, it should be understood that the disclosure may be embodied in various forms and should not be construed as limited to the embodiments set forth herein; A more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the present disclosure are for exemplary purposes only, and are not intended to limit the protection scope of the present disclosure.

[0031] It should be understood that the various steps described in the method implementations of the present disclosure may be executed in different orders, and / or executed in parallel. Additionally, method embodiments may include additional steps and / or omit performing illustrated steps. The scope of the present disclosure is not limited in this regard. ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a hot repair method and device for a software development kit and electronic equipment, and relates to the technical field of information processing. The method comprises the steps of obtaining to-be-repaired codes of a software development kit SDK, the to-be-repaired codes comprising to-be-repaired classes, and the to-be-repaired classes comprising expressions containing syntax sugar; carrying out desugaring treatment on the to-be-repaired classes to generate a private method and an internal class corresponding to the expression containing the syntax sugar; acquiring apatch class corresponding to the to-be-repaired class, and adding the private method and the internal class into the patch class; based on the patch class added with the private method and the internal class, generating each patch corresponding to the to-be-repaired code; and sending each patch to the terminal device, so that the terminal device performs hot repair on the SDK by using each patch.In the technical scheme provided by the invention, the patch corresponding to the to-be-repaired code of the SDK is generated based on the private method generated by the desugaring treatment of the to-be-repaired classes and the internal class. The data volume of the SDK to-be-repaired code cannot be increased, and the usability of the SDK to-be-repaired code is improved.

Description

technical field [0001] The present disclosure relates to the technical field of information processing, and in particular, the present disclosure relates to a software development kit hot repair method, device and electronic equipment. Background technique [0002] A software development kit (Software Development Kit, SDK) refers to a collection of development tools used to create application software for a specific software package, software framework, hardware platform, operating system, and the like. The hot repair technology of the Android platform, in simple terms, is a technology that allows the client of the installed application program to be dynamically updated by issuing a patch package, so that the user can repair software defects without reinstalling the application program. [0003] In the prior art, the SDK code needs to be desugared so that the SDK can run on the Android device. When performing hot fixes for SDK codes containing syntax sugar expressions, it i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06F8/20G06F8/41G06F8/658G06F9/445
CPCG06F8/20G06F8/42G06F8/434G06F8/658G06F9/44526Y02D10/00
Inventor 魏君成
Owner BEIJING BYTEDANCE NETWORK TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products