Wedge amplitude modulation probe card amplitude modulation piece and butt joint structure thereof

Abstract

The invention belongs to the technical field of probe cards, and particularly relates to a wedge block amplitude modulation probe card amplitude modulation piece and a butt joint structure of the wedge block amplitude modulation probe card amplitude modulation piece. The amplitude modulation piece comprises pressing block discs, pressing block disc rings, pressing block disc ring grooves, pressingblock disc rods, pressing block disc blocking cylinders, sliding seats and a shell, wherein the plurality of pressing block discs are arranged on the pressing block disc rod in parallel in a slidingmanner to form pressing blocks; the plurality of pressing block discs are eccentrically arranged on the pressing block disc rods, each pressing block disc is fixedly sleeved with the corresponding pressing block disc ring, and the upper end of each upper wedge plate is provided with one pressing block disc ring groove, so that after rotating, the pressing block discs can be in butt joint with theupper wedge plates through the pressing block rings. In the downward moving process of the pressing block, the pressing block disc horizontally slides along with the upper wedge plates, the pressing block discs and the the upper wedge plates are kept in butt joint in the sliding process, it can be guaranteed that the upper wedge plate slides stably, meanwhile, the multiple pressing block discs arearranged on the pressing block transverse rod in a sliding mode and can move independently, and the pressing block discs can adapt to different horizontal moving distances of the multiple upper wedgeplates.

Description

Technical field [0001] The present invention belongs to the technical field of probe card, and more particularly to a wedge modulation probe card modulation member and a docking structure thereof. Background technique [0002] With the development of the semiconductor industry, more and more electronic devices are accessed on the semiconductor wafer, and in the production process of the semiconductor device, the probe is in contact with the metal end on the semiconductor wafer, and the temporary electrical connection is realized. The electrical signal of the tester is transmitted to the semiconductor device by the probe, and the tester is detected by the returned electrical signal to the electronic device on the semiconductor wafer. [0003] The probe card is a link between the semiconductor wafer and the tester. By integrating a plurality of probes on the probe card, multiple probes are simultaneously contacted with multiple semiconductor devices on the semiconductor wafer, impr...

AI Technical Summary

Problems solved by technology

[0004] In the production process of semiconductor devices, it is necessary to visit a large number of circuit contacts in one or more devices multiple times, and move the probe card through the moving mechanism to make the probes contact with the contacts. At the same time, to match the detection process For multiple sets of contacts in the probe card, multiple probe cards need to be set, and the probe card is fixed by the holder. The holder is a polyhedron that can rotate. By setting one or more probe cards on each surface, the When switching the probe card, by rotating the holder, the corresponding probe card is rotated to the top of the semiconductor device for detection, or multiple movable platforms are set up to move the probe card to realize the connection between the probe card and different contact groups. Matching, in the prior art, in order to realize the detection of multiple sets of contacts, the exchange of probe cards is used to achieve matching, and the matching is achieved by switching different probe cards. Since a single probe card cannot be used universally, the probe The driving structure of the needle card becomes complicated

Images