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Wedge amplitude modulation probe clamp and main body thereof

A technology of probe card and main body, which is applied in the field of probe card and can solve problems such as complex driving structure of probe card

Active Publication Date: 2021-03-19
MAXONE SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the production process of semiconductor devices, it is necessary to visit a large number of circuit contacts in one or more devices multiple times, and move the probe card through the moving mechanism to make the probes contact with the contacts. At the same time, to match the detection process For multiple sets of contacts in the probe card, multiple probe cards need to be set, and the probe card is fixed by the holder. The holder is a polyhedron that can rotate. By setting one or more probe cards on each surface, the When switching the probe card, by rotating the holder, the corresponding probe card is rotated to the top of the semiconductor device for detection, or multiple movable platforms are set up to move the probe card to realize the connection between the probe card and different contact groups. Matching, in the prior art, in order to realize the detection of multiple sets of contacts, the exchange of probe cards is used to achieve matching, and the matching is achieved by switching different probe cards. Since a single probe card cannot be used universally, the probe The driving structure of the needle card becomes complicated

Method used

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  • Wedge amplitude modulation probe clamp and main body thereof
  • Wedge amplitude modulation probe clamp and main body thereof
  • Wedge amplitude modulation probe clamp and main body thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] This embodiment is an embodiment of a wedge amplitude modulation probe card.

[0060] combine figure 1 As shown, a wedge amplitude modulation probe card includes: a probe card main body 1, an upper wedge plate 2 and a lower wedge plate 3, and several upper wedge plates 2 and lower wedge plates 3 are slidingly arranged inside the probe card main body 1. Wedge 3, several upper wedges 2 and lower wedges 3 are alternately arranged in sequence; after the upper wedge 2 is moved down, the upper wedge 2 will push the lower wedge 3 below to the right, so that the lower wedge 3 Upper wedge 2 joins the queue of lower wedge 3.

[0061] combine figure 2 As shown, the probe card main body 1 includes: a main body frame 1-1, a probe groove 1-2 and an upper wedge plate groove 1-3, and several upper wedges are accommodated inside the main body frame 1-1 along the length direction. plate 2 and the lower wedge 3, and the bottom of the main frame 1-1 is provided with a probe slot 1-2 fo...

Embodiment 2

[0079] This embodiment is an embodiment of the main body of the wedge amplitude modulation probe card.

[0080] The main body of a wedge amplitude modulation probe card disclosed in this embodiment is applied to a wedge amplitude modulation probe card in the embodiment.

[0081] combine Figure 1 to Figure 3 As shown, a wedge amplitude modulation probe card body, the interior of the probe card body 1 is slidingly provided with several upper wedges 2 and lower wedges 3, and several upper wedges 2 and lower wedges 3 are sequentially spaced Arranged in a staggered manner; the probe card main body 1 includes: a main body frame 1-1, a probe groove 1-2 and an upper wedge plate groove 1-3, and several upper wedges are accommodated inside the main body frame 1-1 along the length direction plate 2 and the lower wedge 3, and the bottom of the main frame 1-1 is provided with a probe slot 1-2 for the probe to pass through along the length direction, and the main frame 1-1 is also provide...

Embodiment 3

[0085] This embodiment is an embodiment of a probe card wedge amplitude modulation method.

[0086] A probe card wedge amplitude modulation method disclosed in this embodiment is applied to the wedge amplitude modulation probe card disclosed in Embodiment 1.

[0087] combine Figure 4 with Figure 5 As shown, a probe card wedge amplitude modulation method includes the following steps:

[0088] Step a, determine the amplitude modulation distance: before the amplitude modulation, several upper wedges 2 are in side contact, and several lower wedges 3 are in contact with each other, and the upper wedge wedge 2-2 at the lower end of the upper wedge 2 is embedded in the two adjacent adjacent wedges below it. Between the lower wedge heads 3-2 of each lower wedge 3, the upper wedge probes 2-3 of each upper wedge 2 are located above the detection area 100, and the lower wedges of each lower wedge 3 The probes 3-3 are all located in the detection area 100, the upper wedge contact 2-4...

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PUM

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Abstract

The invention belongs to the technical field of probe cards, and particularly relates to a wedge amplitude modulation probe clamp and a main body thereof, the probe clamp comprises a probe clamp mainbody, upper wedge plates and lower wedge plates, a plurality of upper wedge plates and a plurality of lower wedge plates are slidably arranged in the probe clamp main body, and the plurality of upperwedge plates and the plurality of lower wedge plates are sequentially arranged at intervals in a staggered manner. By inserting different numbers of upper wedge plates among the lower wedge plates, the probes on the upper wedge plates can be inserted into or moved out of the probe queue below the upper wedge plates, the number of the probes used for detection is increased or decreased, then the detection amplitude of a single probe clamp can be adjusted, and the probe clamp has universality.

Description

technical field [0001] The invention belongs to the technical field of probe cards, in particular to a wedge amplitude modulation probe card and its main body. Background technique [0002] With the development of the semiconductor industry, more and more electronic devices are connected to the semiconductor wafer. During the manufacturing process of the semiconductor device, the probe is contacted with the metal end on the semiconductor wafer to realize a temporary electrical connection. The electrical signal of the tester is transmitted to the semiconductor device through the probe, and the tester detects the electronic device on the semiconductor wafer through the returned electrical signal. [0003] The probe card is the link between the semiconductor wafer and the tester. By integrating multiple probes on the probe card, multiple probes can be simultaneously contacted with multiple semiconductor devices on the semiconductor wafer to improve detection efficiency. . [...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/073
CPCG01R1/07364G01R31/2889G01R1/07342G01R31/2603
Inventor 于海超周明
Owner MAXONE SEMICON CO LTD