A Wedge AM Probe Card AM Structure

Abstract

The invention belongs to the technical field of probe cards, and in particular relates to a wedge amplitude modulation probe card amplitude modulation structure, which includes: a pressing plate, a pressing plate pin, a pressing plate pin groove, a pressing block bar, a bar slider and a bar Rod spring, a number of pressing plates slide side by side on the pressing bar to form a pressing block, each pressing plate is provided with a pressing plate pin at the lower end, and each upper wedge plate is provided with a pressing block at the upper end The plate pin groove can realize that by moving the pressing block horizontally, aligning with the exposed end of a single or multiple upper wedges, moving the pressing block down, inserting the upper wedge, and docking with the upper wedge through the pressing block, During the downward movement of the briquetting block, the briquetting plate slides horizontally with the upper wedge plate, and keeps docking during the sliding process, which can ensure the stable sliding of the upper wedge plate. Each pressing block plate can move independently, and can adapt to different horizontal moving distances of multiple upper wedge plates.

Description

technical field [0001] The invention belongs to the technical field of probe cards, in particular to a wedge amplitude modulation probe card amplitude modulation structure. Background technique [0002] With the development of the semiconductor industry, more and more electronic devices are connected to the semiconductor wafer. During the manufacturing process of the semiconductor device, the probe is contacted with the metal end on the semiconductor wafer to realize a temporary electrical connection. The electrical signal of the tester is transmitted to the semiconductor device through the probe, and the tester detects the electronic device on the semiconductor wafer through the returned electrical signal. [0003] The probe card is the link between the semiconductor wafer and the tester. By integrating multiple probes on the probe card, multiple probes can be simultaneously contacted with multiple semiconductor devices on the semiconductor wafer to improve detection effici...

AI Technical Summary

Problems solved by technology

[0004] In the production process of semiconductor devices, it is necessary to visit a large number of circuit contacts in one or more devices multiple times, and move the probe card through the moving mechanism to make the probes contact with the contacts. At the same time, to match the detection process For multiple sets of contacts in the probe card, multiple probe cards need to be set, and the probe card is fixed by the holder. The holder is a polyhedron that can rotate. By setting one or more probe cards on each surface, the When switching the probe card, by rotating the holder, the corresponding probe card is rotated to the top of the semiconductor device for detection, or multiple movable platforms are set up to move the probe card to realize the connection between the probe card and different contact groups. Matching, in the prior art, in order to realize the detection of multiple sets of contacts, the exchange of probe cards is used to achieve matching, and the matching is achieved by switching different probe cards. Since a single probe card cannot be used universally, the probe The driving structure of the needle card becomes complicated

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