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Temporary bonding method

A temporary bonding and debonding technology, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of high material cost, high stress, long debonding time, etc., to promote development, save material costs, and reduce debonding. effect of time

Pending Publication Date: 2021-03-16
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of this temporary bonding method are high material cost, high stress, and long debonding time, etc.

Method used

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Embodiment Construction

[0019] Specific embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present disclosure, and are not intended to limit the present disclosure.

[0020] figure 1 is a flowchart of a temporary bonding method according to an embodiment of the present disclosure. Such as figure 1 As shown, the method includes the following steps S11 to S14.

[0021] In step S11, a protective layer is formed on the front surface of the substrate on which the front device layer is prepared.

[0022] The protection layer is mainly used to protect the front device layer in subsequent steps to prevent the front device layer from being damaged.

[0023] The material of the protective layer may be silicon dioxide, silicon nitride, polyimide, phenylpropene cyclobutene and the like. The thickness of the protective layer may b...

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Abstract

The invention relates to a temporary bonding method, belongs to the technical field of semiconductors, and aims to save the material cost, reduce the de-bonding time and avoid thermal stress. The temporary bonding method comprises the following steps: forming a protective layer on the front surface of a substrate on which a front surface device layer is prepared; forming a bulge structure of a nested structure on the protective layer in a re-wiring manner; forming a groove structure of the nested structure on a carrier plate for temporary bonding; and nesting and interlocking the groove structure and the bulge structure.

Description

technical field [0001] The present disclosure relates to the technical field of semiconductors, and in particular, to a temporary bonding method. Background technique [0002] In order to improve the performance and integration of integrated circuits, chips have been integrated in three dimensions. At present, polymer materials such as temporary bonding glue are mostly used for temporary bonding, and the methods are mostly heating, laser, chemical reaction, etc. The disadvantages of this temporary bonding method are high material cost, high stress, and long debonding time. Contents of the invention [0003] The purpose of the present disclosure is to provide a temporary bonding method that can save material cost and reduce debonding time without thermal stress. [0004] According to the first embodiment of the present disclosure, a temporary bonding method is provided, including: forming a protective layer on the front surface of the substrate on which the front device l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50
CPCH01L21/50
Inventor 张卫刘子玉陈琳孙清清
Owner FUDAN UNIV
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