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Electronic component and multilayered capacitor package

A technology of multilayer capacitors and electronic components, applied in the direction of multilayer capacitors, capacitors, fixed capacitors, etc., can solve problems such as device failure, device quality degradation, sensor failure, etc.

Pending Publication Date: 2021-03-23
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] When the device is operating in a quiet environment, the user may perceive the acoustic noise as abnormal and may believe that the device has malfunctioned
[0006] Additionally, acoustic noise may overlap speech output in devices with speech circuitry and the quality of the device may degrade
[0007]In addition to audible acoustic noise, piezoelectric vibrations of multilayer capacitors may cause Failure of sensors used in the IT and automotive industries

Method used

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  • Electronic component and multilayered capacitor package
  • Electronic component and multilayered capacitor package
  • Electronic component and multilayered capacitor package

Examples

Experimental program
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Embodiment Construction

[0028] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0029] This disclosure may, however, be exemplified in many different forms and should not be construed as limited to the specific embodiments set forth herein.

[0030] Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0031] In the drawings, the shapes and sizes of elements may be exaggerated for clarity.

[0032] Furthermore, in the drawings, elements having the same function within the same scope of the inventive concept will be denoted by the same reference numerals.

[0033] Throughout the specification, when a component is referred to as "comprising" or "comprising", it means that the component may also include other components, but does not exclude other components, unless specifically stated otherwise.

[0034] A...

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PUM

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Abstract

Disclosed are an electronic component and a multilayered capacitor package. The electronic component comprises a substrate having first and second electrode pads on one surface; and a multilayered capacitor. The multilayered capacitor comprises: a capacitor body including a dielectric layer and a plurality of internal electrodes layered with the dielectric layer interposed therebetween; and an external electrode respectively disposed on both ends of the capacitor body and connected to an exposed part of the internal electrode. When defining the length of the first or second electrode pad as Lpand the length of the multilayered capacitor as Lc, if Lp / Lc is lower than or equal to 1.35, the dielectric layer and the internal electrode are horizontally layered with respect to the substrate. And, if Lp / Lc is more than 1.35, the dielectric layer and the internal electrode are vertically layered with respect to the substrate.

Description

[0001] This application claims Korean Patent Application No. 10-2019-0116376 filed in the Korean Intellectual Property Office on September 20, 2019 and Korean Patent Application No. 10-2020-0099136 filed in the Korean Intellectual Property Office on August 7, 2020 The benefit of the priority of the patent application, the disclosure of which is incorporated herein by reference in its entirety. technical field [0002] The present disclosure relates to an electronic assembly and multilayer capacitor package. Background technique [0003] Multilayer electronic components such as multilayer capacitors are formed using dielectric materials. Since the dielectric material has piezoelectricity, the dielectric material may deform in synchronization with the applied voltage. [0004] When the period of the applied voltage is in the audio frequency band, the displacement of the voltage can be converted into vibration, the vibration can be transmitted to the board through the solder, ...

Claims

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Application Information

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IPC IPC(8): H01G4/30H01G4/005
CPCH01G4/30H01G4/005Y02P70/50H01G4/12H05K1/111H01G4/232H01G2/06H01G4/2325H05K3/3405H05K1/181H05K2201/10015H01G4/012H01G4/008H01G4/228
Inventor 池求愿朴兴吉朴祥秀安永圭
Owner SAMSUNG ELECTRO MECHANICS CO LTD