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Display module and display device

A technology for display modules and packages, applied in identification devices, static indicators, instruments, etc., can solve the problems of narrowing, increased product cost, and high mold opening cost, and achieve the effect of reducing width and narrowing the lower frame

Pending Publication Date: 2021-03-26
TRULY HUIZHOU SMART DISPLAY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

IC (Integrated Chip) and FPC (Flexible Circuit Board) usually need to be arranged in the lower frame of the display device. The COG (Chip on glass) packaging technology disclosed in the prior art has a technical solution of disposing IC and FPC on the lower substrate respectively. , the technical problem of this packaging technology is: a wide connection area needs to be reserved on the lower substrate to set up IC and FPC, and it is difficult to achieve the effect of narrowing the lower frame
However, the technical problem of COF packaging technology is: the cost of mold opening is high, which leads to a great increase in the cost of the product

Method used

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  • Display module and display device
  • Display module and display device
  • Display module and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Such as Figure 3-4 As shown, this embodiment provides a display module, the display module includes a lower substrate 1, an upper substrate 2, IC3 and FPC4, FPC4 is connected to the lower substrate 1 through IC3, the width of the connection area in this implementation is the same as that of Comparative Example 1 The width of the connection area in is the same. The packaging structure applied to the display module provided by the present application can achieve the effect of narrowing the lower frame and increase the screen ratio.

[0033] Such as Figure 5 As shown, in this embodiment, IC3 is packaged in the package shell 33, the top surface of the package shell 33 is provided with the IC input pin 31, the bottom surface of the package shell 33 is provided with the IC output pin 32, IC3 is input through the IC The terminal pin 31 is electrically connected to the FPC4, and the IC3 is electrically connected to the lower substrate 1 through the IC output pin 32 . At th...

Embodiment 2

[0037] Such as Figure 6 As shown, this embodiment provides a display module, which includes a lower substrate 1 , an upper substrate 2 , an IC 3 and an FPC 4 , and the upper substrate 2 is disposed on the lower substrate 1 . In this embodiment, the upper substrate 2 has a special-shaped structure, and two corners of the bottom of the upper substrate 2 and the lower substrate 1 respectively form connection areas, and IC3 is arranged in the two connection areas. In this embodiment, IC3 is packaged in the package shell 33, the top surface of the package shell 33 is provided with IC input terminal pins 31, the bottom surface of package shell 33 is provided with IC output terminal pins 32, and IC3 passes through the IC input terminal pins. 31 is electrically connected to FPC4, and IC3 is electrically connected to lower substrate 1 through IC output pin 32. The width of the connection area matches the width of the package shell 33 . The top surface of the package shell 33 is also...

Embodiment 3

[0039] Such as Figure 7 As shown, this embodiment provides a display module, the display module includes a lower substrate 1, an upper substrate 2, IC3 and FPC4, the upper substrate 2 is arranged on the lower substrate 1, one side of the lower substrate 1 in this embodiment A connection area is formed between the upper substrate 2, and IC3 is packaged in a package shell 33, the top surface of the package shell 33 is provided with IC input terminal pins 31, and the bottom surface of the package shell 33 is provided with IC output terminal pins 32, IC3 passes through The IC input pin 31 is electrically connected to the FPC4, and the IC3 is electrically connected to the lower substrate 1 through the IC output pin 32 . The specific structure of the package shell 33 matches the connection area. The top surface of the package shell 33 is also provided with an FPC binding pad (not shown in the accompanying drawings), the FPC connection part 41 of the FPC4 is bound and connected wit...

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PUM

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Abstract

The invention relates to a display module. The display module comprises a lower substrate, an upper substrate, an IC and an FPC, wherein the upper substrate is arranged on the lower substrate, and theFPC is connected with the lower substrate through the IC; the IC comprises a packaging piece, an IC output end pin is arranged on the contact end face of the packaging piece and the lower substrate,an IC input end pin is arranged on the contact end face of the packaging piece and the FPC, the IC is electrically connected with the lower substrate through the IC output end pin, and the IC is electrically connected with the FPC through the IC input end pin. The invention further relates to a display device. The display device comprises the display module.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a display module and a display device. Background technique [0002] Under the wave of full screens, display devices are beginning to pursue an overall design with narrower frames, and the upper frame, left frame, and right frame of the display device have been narrowed so far. IC (Integrated Chip) and FPC (Flexible Circuit Board) usually need to be arranged in the lower frame of the display device. The COG (Chip on glass) packaging technology disclosed in the prior art has a technical solution of disposing IC and FPC on the lower substrate respectively. , the technical problem of this packaging technology is: it is necessary to reserve a wide connection area on the lower substrate to install IC and FPC, and it is difficult to achieve the effect of narrowing the lower frame. [0003] In order to achieve the effect of narrowing the lower frame, the COF (Chip on Film) pac...

Claims

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Application Information

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IPC IPC(8): G09F9/30G09G3/20
CPCG09F9/30G09G3/20
Inventor 叶穗丰何晶罗锦钊胡君文
Owner TRULY HUIZHOU SMART DISPLAY