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A soft and hard combination board lamination electromagnetic film lamination jig

A soft-rigid combination board and bonding jig technology, which is used in printed circuits, electrical components, printed circuit manufacturing, etc., can solve the problems of electromagnetic film damage, short production cycle, electromagnetic film offset, etc., to ensure accuracy, improve safety effect

Active Publication Date: 2022-04-29
龙南骏亚柔性智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the industry's soft and hard level difference boards require higher and higher precision for electromagnetic film lamination, and the production cycle of products is getting shorter and shorter. At this time, the time of each production process is required to be compressed to the extreme, but there are still many electromagnetic film lamination industries. Using manual lamination, using iron or soldering iron to heat, the electromagnetic film is prone to shift during the operation process, and the heat dissipation is slow, resulting in damage to the electromagnetic film, which affects the yield and efficiency of lamination production.

Method used

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  • A soft and hard combination board lamination electromagnetic film lamination jig
  • A soft and hard combination board lamination electromagnetic film lamination jig
  • A soft and hard combination board lamination electromagnetic film lamination jig

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] see Figure 1-Figure 5 , a soft and hard combination plate pressing electromagnetic film laminating fixture, including a base 1, an air pipe joint 2, a linear guide rail 3, an electric push rod 4, a lower backing plate 5, a rubber backing plate 6, a supporting plate 7, and a telescopic spring 8 And positioning PIN column 9, the base 1 is provided with an air cavity groove 10, the air pipe joint 2 is installed on the rear side of the air cavity groove 10...

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Abstract

The invention discloses a laminating jig for laminating an electromagnetic film of a flexible and rigid board, and relates to the technical field of circuit board manufacturing. Including the base, air pipe connector, linear guide rail, electric push rod, lower backing plate, rubber backing plate, supporting plate, telescopic spring and positioning PIN column, the base is equipped with an air chamber groove, and the air pipe connector is installed on the rear side of the air chamber groove. The lower backing plate is located on the air cavity groove, the linear guide rail is installed on the air cavity groove, and the sliding end of the linear guide rail is connected with the lower backing plate, the electric push rod is installed on the rear side of the air cavity groove, and the output end of the electric push rod Connect to the bottom plate. The flexible and hard combination plate is pressed and the electromagnetic film laminating fixture is connected to the air chamber groove through the external cold air supply pipeline after hot pressing, and the cold air sent in passes through the first air guide hole, the second air guide hole and the third air guide hole. The air holes are blown out, so that the electromagnetic film and the soft-hard combination board placed on the supporting plate can be cooled quickly, so as to avoid the damage of the electromagnetic film caused by the influence of heat after hot pressing.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a rigid-flex board lamination electromagnetic film lamination jig. Background technique [0002] In today's information age, electronic products are changing rapidly with the pace of the times. Printed circuit boards are more and more widely used in electronic products, such as computers, mobile phones, cameras, video cameras, medical equipment, etc. The printed circuit board industry The development of FPC is changing with each passing day, and there is a development trend from PCB rigid board to FPC flexible circuit board. FPC makes the circuit board lighter and thinner, and its flexibility is greatly improved, especially the combination of rigid and soft circuit boards. The supporting function of the circuit board and the characteristics of the flexible circuit board, so its application has more and more extensive prospects due to its significant advantages...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0058H05K2203/068H05K2203/081H05K2203/167
Inventor 刘传东覃海浪左益明李泽勤岳林
Owner 龙南骏亚柔性智能科技有限公司