A method for testing heat dissipation performance of electronic devices and its thermal resistance tester

Abstract

The invention discloses a method for testing the heat dissipation performance of an electronic device and a thermal resistance tester thereof. The upper end of the column is welded, the electronic device body is placed in the middle of the top of the table, the heat conduction plate is placed on the upper side of the electronic device body, the frame is placed on the upper end of the workbench, and the top of the frame is away from the heat conduction plate. The side is fixed and connected by bolts There is a thermal resistance tester body, and the beneficial effects of the present invention include: the heat is released from the cooling holes, the heat dissipation effect of the electronic device body can be measured through the thermal resistance tester body when the first fan blade is in operation, and by setting the electric telescopic rod and adjusting Mechanism, open the electric telescopic rod to make the two gears of the adjustment mechanism mesh, which can make the first fan blade and the second fan blade rotate at the same time, change the heat dissipation effect, and test the heat dissipation effect of different numbers of peripheral cooling fans.

Description

technical field [0001] The invention relates to the technical field of electronic device performance testing equipment, in particular to a method for testing the heat dissipation performance of electronic devices and a thermal resistance tester thereof. Background technique [0002] Before the electronic device is installed, it is necessary to conduct a heat dissipation test to ensure that the electronic device has a good heat dissipation effect when it is installed inside the device, and to ensure the use effect of the electronic device. When conducting the heat dissipation test of the electronic device, it is necessary to use the thermal resistance test The surface temperature of the device is tested by the instrument to obtain the thermal resistance value for detection. [0003] In the prior art, when testing electronic devices, the resistance value is generally tested directly by changing the temperature of the device, but it is impossible to measure the heat dissipation...

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a heat dissipation performance test method of an electronic device and its thermal resistance tester to solve the problem that the resistance value is generally tested directly by changing the temperature of the device when the electronic device is tested in the above-mentioned background technology, but cannot Measure the heat dissipation effect of electronic devices equipped with external heat dissipation components

Images