A power amplifier chip, chip testing system and method
A technology for testing power amplifiers and chips, which is applied to electronic circuit testing, instruments, and measuring electronics. It can solve the problems of poor classification of chips, low efficiency of chip testing, and failure to consider chip testing, etc., so as to facilitate later testing. , Improve test efficiency, rapid test effect
Active Publication Date: 2021-09-10
四川省华盾防务科技股份有限公司
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Problems solved by technology
[0002] In the batch test process of existing chips, the test reports generated during the whole test process are complicated, and the chip test in the later stage is not considered in the chip design process, resulting in low chip test efficiency, and it cannot be carried out for chips with different constitutions. good classification
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[0034] The technical solution of the present invention will be further described in detail below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following description.
[0035] like figure 1 As shown, a power amplifier chip includes a power supply module, a microwave module, and a heat dissipation module; the power supply module is used to supply power to the microwave module and the heat dissipation module; the heat dissipation module is used to dissipate heat for the microwave module; the microwave The module is arranged on the cooling module; the microwave module is used to amplify signals;
[0036] The power supply module includes a power filter module, a power detection module, a temperature detection module, a power consumption detection module, a surge protection module, and a voltage stabilization module; the surge protection module, a power supply filter module, a voltage stabilization module, and ...
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The invention discloses a power amplifier chip, comprising a power supply module, a microwave module and a heat dissipation module; the power supply module is used for supplying power to the microwave module and the heat dissipation module; the heat dissipation module is used for heat dissipation for the microwave module; The microwave module is arranged on the heat dissipation module; the power module includes a power filter module, a power detection module, a temperature detection module, a power consumption detection module, a surge protection module, and a voltage regulator module; the microwave module includes a signal input module, a microwave amplifier and a signal output module; the signal input module, the microwave amplifier and the signal output module are connected in sequence; the microwave amplifier is connected with the voltage regulator module; the power detection module is connected with the signal output module; The heat dissipation module described is a semiconductor heat dissipation module. Through the present invention, a power amplifier chip can be obtained.
Description
technical field [0001] The invention relates to the field of power amplifiers, in particular to a power amplifier chip, a chip testing system and a method. Background technique [0002] In the batch test process of existing chips, the test reports generated during the whole test process are complicated, and the chip test in the later stage is not considered in the chip design process, resulting in low chip test efficiency, and it cannot be carried out for chips with different constitutions. Nice assortment. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies in the prior art, and provide a power amplifier chip, including a power module, a microwave module, and a heat dissipation module; the power supply module is used to supply power to the microwave module and the heat dissipation module; To dissipate heat for the microwave module; the microwave module is arranged on the heat dissipation module; [0004] The power supp...
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IPC IPC(8): G01R31/28G01R31/01
CPCG01R31/01G01R31/2851G01R31/2868G01R31/2874
Inventor 蒲朝斌
Owner 四川省华盾防务科技股份有限公司