Heat dissipation device and heat dissipation method based on shape memory alloy

Abstract

A heat dissipation device and heat dissipation method based on a shape memory alloy. The heat dissipation device includes a base. A heat sink, a spring, and a shape memory alloy are arranged on one side of the base. A pretensioning device is installed on the other side of the base through the base. The device is connected to one end of the spring, and the other end of the spring is connected to the shape memory alloy, which is fixed on the base and can be supported by the spring; the shape memory alloy can contact the heat source equipment in the original long state to absorb heat, and the shape memory alloy In the contracted state, it can contact the heat sink to dissipate heat. The invention also provides a heat dissipation method based on the shape memory alloy. The invention not only realizes high-efficiency heat transfer, but also realizes long-distance heat transmission by utilizing the phase-change contraction characteristics of shape memory alloys, and does not require additional power consumption or refrigerant, and has the advantages of environmental protection and energy saving.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation, and in particular relates to a heat dissipation device and a heat dissipation method based on a shape memory alloy. Background technique [0002] With the advancement and development of science and technology, various new electronic devices used in different fields have been continuously developed, and matching heat dissipation equipment has become the key to the efficient operation of electronic devices. If the heat of electronic devices cannot be discharged in time, it will Seriously affect the normal operation of electronic equipment. At present, most fin radiators absorb heat through direct contact with the heating part of electronic equipment, and take the heat away through fans; while heat pipes use the principle of heat conduction and refrigerant phase change medium heat transfer to transfer heat to the outside of the heat source. The limitation of the former is that the distance...

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Problems solved by technology

[0003] The object of the present invention is to provide a heat dissipation device and heat dissipation method based on shape memory alloys to achieve efficient heat dissipation and green energy saving in view of the problems of poor heat dissipation of radiators and environmental pollution caused by refrigerants in the prior art

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