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Wafer automatic positioning teaching system and method

A technology of automatic positioning and teaching method, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of large space for multi-view image acquisition, and achieve the effect of reducing light pollution, easy operation, and space saving

Active Publication Date: 2021-08-03
宁波润华全芯微电子设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, the embodiments of the present invention provide a wafer automatic positioning teaching system and method, which can effectively solve the problem that the actual wafer image needs to be acquired and supplemented with light every time the wafer is aligned, and multi-view image acquisition requires a large space. question

Method used

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  • Wafer automatic positioning teaching system and method
  • Wafer automatic positioning teaching system and method
  • Wafer automatic positioning teaching system and method

Examples

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no. 1 example

[0040] See Figure 1-4 It provides a wafer automatic positioning teaching system 100 for the first embodiment of the present invention, including, for example, a bearing table 110, a panel 120, a conveying device 130, a positioning device 140, and a control device. Wherein, the carrier 110 is used to mount the wafer, and the transport device 130 is located above the carrier 110 for carrying the wafer to the carrier 110, and complete the pair of wafer and the carrier 110; The wafer pair is previously mounted to the conveying device 130, priorituting the pair of chopper trays 120 and the bearing table 110, thereby achieving the wafer, the wafer can be compared The central deviation of the chopper plate 120 can be realized, and the image acquisition device 121 is provided with the center of the panel 120 toward the side of the bearing table 110 for collecting the image of the carrier 110; positioning device 140, connection handling Apparatus 130 is configured to acquire a central posi...

no. 2 example

[0056] A second embodiment of the present invention provides a wafer automatic positioning teaching method. See Image 6 The wafer automatic positioning teaching method includes, for example,:

[0057] Step S1: The handling device 130 handles the taught panel 120;

[0058] Step S2: The positioning device 140 acquires the central position of the chopcha 120, and the image acquisition device 121 acquires the positioning hole 111 image at the center of the bearing table 110;

[0059] Step S3: The control device calculates that the center position of the chopcha 120 and the positioning hole 111 is adjusted to the central position of the chopper 120 and the positioning hole 111;

[0060] Step S4: The handling device 130 handling wafer;

[0061] Step S5: The positioning device 140 acquires the center position of the wafer;

[0062] Step S6: The control device calculates the center position of the wafer and the deviation of the positioning hole 111, and the adjustment conveyance device 13...

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Abstract

The invention discloses a wafer automatic positioning teaching system and method. The wafer automatic positioning teaching system comprises: a bearing platform; an image acquisition device which is arranged in the center of one side, facing the bearing table, of the teaching disc and is used for acquiring an image of the bearing table; a carrying device which is used for carrying the teaching disc or the wafer; a positioning device which is arranged on the carrying device and is used for acquiring the central position of the teaching disc or the wafer; and a control device which is connected with the image acquisition device, the carrying device and the positioning device, wherein the image acquisition device, the carrying device and the positioning device are controlled to be concentric according to the image of the bearing table and the central position of the teaching disc, the center position of the wafer is obtained through the positioning device, and the wafer and the bearing table are adjusted to be concentric according to the center deviation of the wafer and the teaching disc. According to the invention, the problems that the actual image of the wafer needs to be obtained and light supplement needs to be carried out every time wafer centering is carried out, and the multi-view image acquisition needs a large space are effectively solved.

Description

Technical field [0001] The present invention relates to the field of semiconductor wafers, and more particularly to a wafer automatic positioning teaching system and method. Background technique [0002] In the process of the wafer, the wafer needs to be placed in the vehicle bearing station, so the pairing is required. The current wafer pair is to place the wafer on the carrier, acquire an image of a plurality of viewing angles of the wafer and the carrier by a plurality of image acquisition devices, and computes the bias, control. The film is taken to adjust the wafer to the reference position. [0003] However, there is a problem in the current method: each placement of the wafer needs to obtain a plurality of viewing angles of the wafer, and compare the reference image, the operation is more cumbersome; and the image of the wafer is obtained. The image acquisition device needs to be set at multiple angles, for the smaller wafer, the distribution of multiple image acquisition ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/68H01L21/66
CPCH01L21/67259H01L21/681H01L22/12H01L22/20
Inventor 陈胜华王伟朱勇杰
Owner 宁波润华全芯微电子设备有限公司