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A kind of binding method of aluminum rotating target

A technology of rotating target and aluminum target, applied in metal material coating process, vacuum evaporation plating, coating and other directions, can solve the problems of low hardness of metal aluminum, reducing the binding rate of target materials, affecting the effect of surface metallization, etc. , to achieve the effect of high binding rate, high production efficiency, and avoiding alloy impurities

Active Publication Date: 2022-08-05
XIANDAO THIN FILM MATERIALS GUANGDONG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the target material is aluminum, due to the low hardness of metal aluminum, it is easy to rub against the coating probe during the process of surface metallization (also known as coating), forming an Al-Cu alloy and floating on the surface of the target material. , and wrap the coating probe, which seriously affects the effect of surface metallization, and finally reduces the binding rate of the target

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] An embodiment of the method for binding an aluminum rotating target according to the present invention includes the following steps:

[0030] (1) Back tube coating: After cleaning the back tube, put it into the back tube coater and heat it to 185°C, then pour the indium solution at 190°C while rotating at a speed of 8r / min, and use the probe on the back tube. Coating on top, and cooling together with the coating machine after the entire back tube is coated;

[0031] (2) Target coating: Put the aluminum target cylinder into the target coating machine, turn on the rotation and heat it to 195°C, pour the indium solution and apply it evenly on the aluminum target cylinder with a wire brush The surface is placed and cooled with the coating machine after being coated with the probe; the speed of the rotation is 5r / min, and the angle between the probe and the inner surface of the aluminum target cylinder is controlled at 25°; the use of the probe When coating, after a circle ...

Embodiment 2

[0034] An embodiment of the method for binding an aluminum rotating target according to the present invention includes the following steps:

[0035] (1) Back tube coating: After cleaning the back tube, put it into the back tube coater and heat it to 195 ° C, then pour the indium solution at 195 ° C while rotating at a speed of 10 r / min, and use the probe on the back tube. Coating on top, and cooling together with the coating machine after the entire back tube is coated;

[0036] (2) Target coating: Put the aluminum target cylinder into the target coating machine, turn on the rotation and heat it to 185°C, pour the indium solution and apply it evenly on the aluminum target cylinder with a wire brush The surface is placed and cooled with the coating machine after being coated with the probe; the speed of the rotation is 5r / min, and the angle between the probe and the inner surface of the aluminum target cylinder is controlled at 35°; the use of the probe When coating, after a c...

Embodiment 3

[0039] An embodiment of the method for binding an aluminum rotating target according to the present invention includes the following steps:

[0040] (1) Back tube coating: After cleaning the back tube, put it into the back tube coater and heat it to 180°C, then pour the indium solution at 200°C while rotating at a speed of 6r / min, and use the probe on the back tube. Coating on top, and cooling together with the coating machine after the entire back tube is coated;

[0041] (2) Target coating: Put the aluminum target cylinder into the target coating machine, turn on the rotation and heat it to 180°C, pour the indium solution and apply it evenly on the aluminum target cylinder with a wire brush The surface is placed and cooled with the coating machine after being coated with the probe; the speed of the rotation is 3r / min, and the angle between the probe and the inner surface of the aluminum target cylinder is controlled at 30°; the use of the probe When coating, after a circle ...

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PUM

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Abstract

The invention discloses a binding method for an aluminum rotating target, and belongs to the field of sputtering target preparation. The binding method of the aluminum rotating target according to the present invention firstly performs coating metallization treatment on the back tube and the target material under specific conditions, and then performs heating and binding of the two, which can effectively maintain the wettability of the solder while maintaining the solder wettability. To avoid alloy impurities generated during the binding process of the target, the aluminum rotating target has a high binding rate and high production efficiency after being processed.

Description

technical field [0001] The invention belongs to the field of sputtering target preparation, in particular to a binding method for an aluminum rotating target. Background technique [0002] At present, the targets used in the sputtering coating industry are usually manufactured by bonding and binding. The rotating target is generally bound on a stainless steel back tube or a titanium back tube. The binding process commonly used in the target binding process The solder is metallic indium or other metallic substances. [0003] High-quality targets are the basis for thin film applications, and the target binding associated with the target also affects the quality of the thin films. Target binding is a target deep processing technology, that is to use materials with good wettability and ductility to bond the target and the backplane together, and the formed bonding layer has certain electrical conductivity, thermal conductivity and Adhesive strength, the wettability between the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/34C23C26/02B22D19/04
CPCC23C14/3414C23C26/02B22D19/04
Inventor 余芳文崇斌朱刘王英洁
Owner XIANDAO THIN FILM MATERIALS GUANGDONG CO LTD
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