The invention discloses low-temperature lead-free solder and used for welding electrical contact materials. The low-temperature lead-free solder comprises, by mass percent, 30%-65% of Bi, 15%-50% of Sn and 15%-45% of In. To improve the mechanical performance of the alloy solder and improve the oxidation resistance, the wettability and the like, one or more of microelements including Ag, Zn, Al, Cu, Ga, P and the like is appropriately added. The melting point of the low-temperature solder is controlled within the range of 75 DEG C-100 DEG C, is used for removing damage of welding temperature toa welded object in the welding process and has the advantages that the melting temperature is low, during welding, the binding rate with copper foil is high, the loss tangent value of a capacitor issmall, the partial discharging performance and the overvoltage and large current resistance of the capacitor are improved, the cost is relatively low, no lead exists and the low-temperature lead-freesolder is more environmentally friendly. The low-temperature lead-free solder is especially suitable for welding heat sensitive elements, semiconductor elements with semiconductor manner refrigeratingelements and the like.