The invention belongs to the technical field of
copper-clad aluminum wire manufacturing, and discloses a high-
interface bonding rate
copper-clad aluminum wire forming process which comprises the following steps: S1,
raw material preparation and pretreatment: a, aluminum rod and
copper strip preparation:
processing and slitting an aluminum rod and a copper strip; the
bonding strength and quality between the copper layer and the aluminum core are remarkably improved through
electric field assisted bonding treatment, the
diffusion process between copper atoms and aluminum atoms can be accelerated through the
electric field, bonding between the copper layer and the aluminum core is tighter, and the effect of the
electric field is similar to a driving force; according to the copper-clad aluminum wire forming process, atoms can cross an energy barrier more easily under the action of electric field force, so that more efficient combination is achieved, interaction force between the atoms is enhanced under the action of an electric field, the
interface bonding force is improved, and the copper-clad aluminum wire forming process under the assistance of the electric field can remarkably improve the
bonding strength between a copper layer and an aluminum core; therefore, the high
interface bonding rate is greatly improved, and the interface bonding between the copper layer and the aluminum core is firmer and more stable.